Intel Core i7-3770K vs Intel Core i7-920
Better figure, where one is clearly better
| IntelCore i7-3770K | IntelCore i7-920 | |
|---|---|---|
| Overview | ||
| Released | April 2012 | November 2008 |
| Cores and clocks | ||
| Cores | 4 | 4 |
| Threads | 8 | 8 |
| Base clock | 3.5 GHz | 2.66 GHz |
| Boost clock | 3.9 GHz (better) | 2.93 GHz |
| L3 cache | 8 MB | 8 MB |
| Cores | Four cores with Hyper-Threading; Intel Turbo Boost 2.0. TechRadar confirms the unlocked multiplier. | Four cores with Hyper-Threading; eight simultaneous threads. PCStats confirms a locked CPU multiplier; base-clock overclocking is possible, so locked does not mean all overclocking is disabled. |
| Clocks | Maximum turbo is a single-core frequency. Intel announced systems available on 23 April and boxed processors later that month; the 29 April retail sale date comes from Ars Technica's update quoting Newegg. | Intel's product brief gives up to 2.93 GHz single-core Turbo Boost. Intel's 17 November 2008 sale notice names the 920 and confirms immediate system and boxed retail availability. |
| Graphics and AI | ||
| Built-in graphics | Yes | No |
| Graphics | Intel HD Graphics 4000; 650 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. | No processor graphics; a separate graphics solution is required. Intel's desktop comparison chart lists graphics as not applicable. |
| Platform | ||
| Socket | LGA1155 | LGA1366 |
| Base power | 77 W | 130 W |
| Unlocked | Yes | No |
| Memory support | Up to 32 GB; two channels; DDR3-1333/1600; 25.6 GB/s maximum bandwidth; ECC not supported. | Three channels of DDR3-1066 in Intel's exact-model product brief. A later Intel comparison chart incorrectly lists two channels; the original product brief is used here. |
| PCIe | PCIe 3.0; configurations up to 1×16, 2×8 or 1×8+2×4. | Intel's product brief describes X58 chipset PCIe 2.0 graphics connectivity, including two ×16 links. These are chipset connections, not CPU-integrated PCIe lanes. CPU-to-chipset QuickPath Interconnect runs at 4.8 GT/s for the 920. |
| Process | 22 nm; Ivy Bridge; 37.5 × 37.5 mm package; 67.4°C maximum case temperature, not junction temperature. | 45 nm; Nehalem architecture. |
| Cooler | LGA1155 motherboard compatibility depends on chipset and firmware; Expert Reviews advises confirming older 6-series board support with the motherboard maker. Intel's current specifications give no separate maximum turbo-power figure. | Requires an LGA1366/X58 platform; incompatible with LGA775 motherboards. Intel's retired specification page could not be read, so optional package temperature and separate maximum-power values are omitted. |
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