Intel Core i7-5775C vs Intel Core i7-6700K

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Core i7-5775C compared with Core i7-6700K

	IntelCore i7-5775C	IntelCore i7-6700K
Overview
Released
Released	June 2015	August 2015
Cores and clocks
Cores
Cores	4	4
Threads
Threads	8	8
Base clock
Base clock	3.3 GHz	4 GHz
Boost clock
Boost clock	3.7 GHz	4.2 GHz (better)
L3 cache
L3 cache	6 MB	8 MB (better)
Cores
Cores	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported. CPU multiplier overclocking is confirmed by PC Gamer and PCWorld.	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported.
Clocks
Clocks	Maximum turbo is a single-core frequency. Intel also publishes a 37 W configurable TDP-down mode at a 2.2 GHz base frequency. Intel's June 2015 driver notes describe the model as newly launched; Velocity Micro offered systems immediately in June, while PC Gamer reported delayed availability of separately boxed processors.	Maximum turbo is a single-core frequency; overclocking requires an appropriate motherboard and cooling. Intel publishes TDP without a separate maximum turbo-power figure.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Intel Iris Pro Graphics 6200; 300 MHz base, up to 1.15 GHz; 128 MB eDRAM; three displays; Quick Sync Video. DisplayPort up to 3840×2160 at 60 Hz; HDMI up to 4096×2304 at 24 Hz.	Intel HD Graphics 530; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. DisplayPort and eDP up to 4096×2304 at 60 Hz; HDMI up to 4096×2304 at 24 Hz.
Platform
Socket
Socket	LGA1150	LGA1151
Base power
Base power	65 W	91 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	–	No
Memory support
Memory support	Up to 32 GB; two channels; DDR3L-1333/1600 at 1.5 V, as Intel specifies; 25.6 GB/s maximum bandwidth; ECC not supported.	Up to 64 GB; two channels; DDR4-1866/2133 or DDR3L-1333/1600 at 1.35 V; 34.1 GB/s maximum bandwidth; ECC not supported.
PCIe
PCIe	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4. PC Gamer describes the Z170 platform's faster DMI 3.0 chipset link and expanded storage connectivity.
Process
Process	14 nm; Broadwell; 37.5 × 37.5 mm package.	14 nm; Skylake; 37.5 × 37.5 mm package; Intel lists a 64°C Tcase limit, which is a case-temperature specification rather than a junction-temperature limit.
Cooler
Cooler	LGA1150 motherboard support depends on the board and BIOS. PC Gamer's firmware difficulties concern its early engineering sample and do not establish a fault in every retail processor.	Boxed processor includes no fan or heatsink. Requires a compatible Intel 100-series motherboard; the launch notice names the Z170 chipset for unlocked processors.