Intel Core i7-6700K vs Intel Core i7-7700K

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Core i7-6700K compared with Core i7-7700K

	IntelCore i7-6700K	IntelCore i7-7700K
Overview
Released
Released	August 2015	January 2017
Cores and clocks
Cores
Cores	4	4
Threads
Threads	8	8
Base clock
Base clock	4 GHz	4.2 GHz
Boost clock
Boost clock	4.2 GHz	4.5 GHz (better)
L3 cache
L3 cache	8 MB	8 MB
Cores
Cores	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported.	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported.
Clocks
Clocks	Maximum turbo is a single-core frequency; overclocking requires an appropriate motherboard and cooling. Intel publishes TDP without a separate maximum turbo-power figure.	Maximum turbo is a single-core frequency; overclocking requires an appropriate motherboard and cooling. Intel publishes TDP without a separate maximum turbo-power figure.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Intel HD Graphics 530; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. DisplayPort and eDP up to 4096×2304 at 60 Hz; HDMI up to 4096×2304 at 24 Hz.	Intel HD Graphics 630; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. Hardware HEVC 10-bit encode and decode, and VP9 10-bit decode, according to Intel's desktop product brief.
Platform
Socket
Socket	LGA1151	LGA1151
Base power
Base power	91 W	91 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	Up to 64 GB; two channels; DDR4-1866/2133 or DDR3L-1333/1600 at 1.35 V; 34.1 GB/s maximum bandwidth; ECC not supported.	Up to 64 GB; two channels; DDR4-2133/2400 or DDR3L-1333/1600 at 1.35 V; ECC not supported.
PCIe
PCIe	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4. PC Gamer describes the Z170 platform's faster DMI 3.0 chipset link and expanded storage connectivity.	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.
Process
Process	14 nm; Skylake; 37.5 × 37.5 mm package; Intel lists a 64°C Tcase limit, which is a case-temperature specification rather than a junction-temperature limit.	14 nm; Kaby Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel describes the manufacturing process as 14 nm+ in its product brief.
Cooler
Cooler	Boxed processor includes no fan or heatsink. Requires a compatible Intel 100-series motherboard; the launch notice names the Z170 chipset for unlocked processors.	Boxed processor includes no fan or heatsink. Intel announced the desktop family on 3 January 2017; TechSpot's contemporaneous launch review confirms availability that day.