AMD Ryzen 5 5600 vs Intel Core i5-750
Better figure, where one is clearly better
| AMDRyzen 5 5600 | IntelCore i5-750 | |
|---|---|---|
| Overview | ||
| Released | April 2022 | September 2009 |
| Cores and clocks | ||
| Cores | 6 (better) | 4 |
| Threads | 12 (better) | 4 |
| Base clock | 3.5 GHz | 2.66 GHz |
| Boost clock | 4.4 GHz (better) | 3.2 GHz |
| L3 cache | 32 MB (better) | 8 MB |
| Cores | Zen 3; Vermeer; 2 package dies; simultaneous multithreading | Four cores and four threads; Hyper-Threading is absent. TechRadar's exact Core i5-750 overclocking guide confirms the CPU multiplier is locked; base-clock overclocking remains possible. |
| Clocks | Precision Boost 2; unlocked for overclocking | Up to 3.20 GHz Turbo Boost. Intel's embedded product brief specifies 3.20 GHz with one or two active cores and 2.80 GHz with four; actual behaviour depends on workload, cooling and platform limits. |
| Cache | L1 384 KB; L2 3 MB; L3 32 MB | – |
| Graphics and AI | ||
| Built-in graphics | No | No |
| Graphics | No integrated graphics; a separate graphics card is required | No processor graphics; Intel's desktop comparison chart lists graphics as not applicable. A separate graphics solution is required. |
| Platform | ||
| Socket | AM4 | LGA1156 |
| Base power | 65 W | 95 W |
| Unlocked | Yes | No |
| Cooler in the box | Yes | – |
| Memory support | DDR4 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR4-3200; 4 single-rank DIMMs: DDR4-2933; 4 dual-rank DIMMs: DDR4-2667 | Two channels of DDR3-1066/1333. Optional maximum memory capacity and bandwidth are omitted because the retired exact-model specification page could not be read. |
| PCIe | PCIe 4.0; 24 native lanes, 20 usable; 4 native USB 3.2 Gen 2 ports and 2 SATA ports | 16 processor PCIe 2.0 lanes, configurable as one ×16 or two ×8 graphics links. A separate DMI link connects the processor to the chipset. |
| Chipsets | X570, X470, X370, B550, B450, B350 and A520 | – |
| Process | TSMC 7nm FinFET CPU cores; GlobalFoundries 12nm I/O die; CPU compute die 74 mm², I/O die 125 mm² | 45 nm; Lynnfield, based on the Nehalem architecture. |
| Cooler | AMD Wraith Stealth; Tjmax 90°C | LGA1156 platform, distinct from LGA775 and LGA1366. Intel's 8 September 2009 notice names the 750 and says the new processors and P55 chipset are available that day. Cooler inclusion and package temperature are omitted where maker evidence is unavailable. |
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