AMD Ryzen 5 8600G vs Intel Core i5-14500

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Ryzen 5 8600G compared with Core i5-14500

	AMDRyzen 5 8600G	IntelCore i5-14500
Overview
Released
Released	January 2024	January 2024
Cores and clocks
Cores
Cores	6	14 (6 performance, 8 efficiency) (better)
Threads
Threads	12	20 (better)
Base clock
Base clock	4.3 GHz	2.6 GHz
Boost clock
Boost clock	5 GHz	5 GHz
L3 cache
L3 cache	16 MB	24 MB (better)
Cores
Cores	Zen 4; Phoenix; simultaneous multithreading; one monolithic package die.	6 P-cores and 8 E-cores; 20 threads. ComputerBase identifies its tested sample as C0 Alder Lake silicon within the marketed Raptor Lake Refresh generation.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported; configurable TDP 45–65 W.	P-cores: 2.6 GHz base, up to 5.0 GHz turbo. E-cores: 1.9 GHz base, up to 3.7 GHz turbo.
Cache
Cache	6 MB L2; 16 MB L3.	24 MB Intel Smart Cache (L3); 11.5 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Radeon 760M; RDNA 3; eight graphics cores at 2800 MHz; up to four displays; DisplayPort 2.1 and HDMI 2.1; hardware AV1 encode and decode.	Intel UHD Graphics 770; 32 execution units; up to 1.55 GHz; Quick Sync Video; up to four displays.
AI engine
AI engine	AMD Ryzen AI; XDNA neural processing unit; up to 16 TOPS.	–
Platform
Socket
Socket	AM5	LGA1700
Base power
Base power	65 W	65 W
Maximum power
Maximum power	–	154 W
Unlocked
Unlocked	Yes	No
Cooler in the box
Cooler in the box	–	Yes
Memory support
Memory support	DDR5 UDIMM; two channels; up to 256 GB on the current AMD specification page. Two single- or dual-rank DIMMs: DDR5-5200; four single- or dual-rank DIMMs: DDR5-3600.	Up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s; ECC supported with an appropriate platform.
PCIe
PCIe	PCIe 4.0; 20 native lanes, 16 usable, as published by AMD; discrete graphics slot up to ×8 (PC Gamer). Two native USB4 40 Gbps, two USB 3.2 Gen 2 10 Gbps and one USB 2.0 port.	PCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	AMD lists A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850; motherboard firmware support required.	Intel 600- and 700-series motherboards; appropriate BIOS support required.
Process
Process	TSMC 4nm FinFET; 178 mm² CPU compute die.	Intel 7; Raptor Lake Refresh generation. ComputerBase identifies the tested sample as C0 Alder Lake silicon. 45 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	95°C maximum operating temperature. Retail review boxes included a Wraith Stealth air cooler (PC Gamer and PCGamesN); tray products do not establish the same bundle.	Intel Laminar RM1 included with the boxed processor (Intel support).