AMD Ryzen 7 8700G vs Intel Core i5-14500

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Ryzen 7 8700G compared with Core i5-14500

	AMDRyzen 7 8700G	IntelCore i5-14500
Overview
Released
Released	January 2024	January 2024
Cores and clocks
Cores
Cores	8	14 (6 performance, 8 efficiency) (better)
Threads
Threads	16	20 (better)
Base clock
Base clock	4.2 GHz	2.6 GHz
Boost clock
Boost clock	5.1 GHz (better)	5 GHz
L3 cache
L3 cache	16 MB	24 MB (better)
Cores
Cores	Zen 4; Phoenix; simultaneous multithreading; one monolithic package die.	6 P-cores and 8 E-cores; 20 threads. ComputerBase identifies its tested sample as C0 Alder Lake silicon within the marketed Raptor Lake Refresh generation.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported; configurable TDP 45–65 W.	P-cores: 2.6 GHz base, up to 5.0 GHz turbo. E-cores: 1.9 GHz base, up to 3.7 GHz turbo.
Cache
Cache	8 MB L2; 16 MB L3.	24 MB Intel Smart Cache (L3); 11.5 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Radeon 780M; RDNA 3; 12 graphics cores at 2900 MHz; up to four displays; DisplayPort 2.1 and HDMI 2.1; hardware AV1 encode and decode.	Intel UHD Graphics 770; 32 execution units; up to 1.55 GHz; Quick Sync Video; up to four displays.
AI engine
AI engine	AMD Ryzen AI; XDNA neural processing unit; up to 16 TOPS.	–
Platform
Socket
Socket	AM5	LGA1700
Base power
Base power	65 W	65 W
Maximum power
Maximum power	–	154 W
Unlocked
Unlocked	Yes	No
Cooler in the box
Cooler in the box	–	Yes
Memory support
Memory support	DDR5 UDIMM; two channels; up to 256 GB on the current AMD specification page; ECC requires platform support. Two single- or dual-rank DIMMs: DDR5-5200; four single- or dual-rank DIMMs: DDR5-3600.	Up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s; ECC supported with an appropriate platform.
PCIe
PCIe	PCIe 4.0; 20 native lanes, 16 usable; discrete graphics slot up to ×8 (PC Gamer and TechSpot). Two native USB4 40 Gbps, two USB 3.2 Gen 2 10 Gbps and one USB 2.0 port.	PCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	AMD lists A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850; motherboard firmware support required.	Intel 600- and 700-series motherboards; appropriate BIOS support required.
Process
Process	TSMC 4nm FinFET; 178 mm² CPU compute die.	Intel 7; Raptor Lake Refresh generation. ComputerBase identifies the tested sample as C0 Alder Lake silicon. 45 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	95°C maximum operating temperature. Launch review boxes included a Wraith Spire (PC Gamer); current AMD IDs include SBX and CSX, and the maker notes revised cooler bundles for selected MPK models from August 2025. Verify the exact retail bundle.	Intel Laminar RM1 included with the boxed processor (Intel support).