AMD Ryzen 7 5700X3D vs AMD Ryzen 7 8700G

Every spec side by side, from each maker's published figures.

Only show differences

Better figure, where one is clearly better

Share comparison

Ryzen 7 5700X3D compared with Ryzen 7 8700G

	AMDRyzen 7 5700X3D	AMDRyzen 7 8700G
Overview
Released
Released	January 2024	January 2024
Cores and clocks
Cores
Cores	8	8
Threads
Threads	16	16
Base clock
Base clock	3 GHz	4.2 GHz
Boost clock
Boost clock	4.1 GHz	5.1 GHz (better)
L3 cache
L3 cache	96 MB (better)	16 MB
Cores
Cores	Zen 3; Vermeer; 2 package dies; simultaneous multithreading	Zen 4; Phoenix; simultaneous multithreading; one monolithic package die.
Clocks
Clocks	No direct multiplier-based CPU overclocking, core-voltage adjustment or officially supported PBO (Tom's Hardware). AMD support lists 8 January announcement; maker release states sale from 31 January 2024	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported; configurable TDP 45–65 W.
Cache
Cache	L1 512 KB; L2 4 MB; L3 96 MB	8 MB L2; 16 MB L3.
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics; a separate graphics card is required	Radeon 780M; RDNA 3; 12 graphics cores at 2900 MHz; up to four displays; DisplayPort 2.1 and HDMI 2.1; hardware AV1 encode and decode.
AI engine
AI engine	–	AMD Ryzen AI; XDNA neural processing unit; up to 16 TOPS.
Platform
Socket
Socket	AM4	AM5
Base power
Base power	105 W	65 W
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	No	–
Memory support
Memory support	DDR4 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR4-3200; 4 single-rank DIMMs: DDR4-2933; 4 dual-rank DIMMs: DDR4-2667	DDR5 UDIMM; two channels; up to 256 GB on the current AMD specification page; ECC requires platform support. Two single- or dual-rank DIMMs: DDR5-5200; four single- or dual-rank DIMMs: DDR5-3600.
PCIe
PCIe	PCIe 4.0; 24 native lanes, 20 usable; 4 native USB 3.2 Gen 2 ports and 2 SATA ports	PCIe 4.0; 20 native lanes, 16 usable; discrete graphics slot up to ×8 (PC Gamer and TechSpot). Two native USB4 40 Gbps, two USB 3.2 Gen 2 10 Gbps and one USB 2.0 port.
Chipsets
Chipsets	X570, X470, B550, B450 and A520	AMD lists A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850; motherboard firmware support required.
Process
Process	TSMC 7nm FinFET CPU cores; GlobalFoundries 12nm I/O die; CPU compute die 74 mm², I/O die 125 mm²	TSMC 4nm FinFET; 178 mm² CPU compute die.
Cooler
Cooler	Not included; Tjmax 90°C	95°C maximum operating temperature. Launch review boxes included a Wraith Spire (PC Gamer); current AMD IDs include SBX and CSX, and the maker notes revised cooler bundles for selected MPK models from August 2025. Verify the exact retail bundle.