AMD Ryzen 7 5800X3D vs Intel Core i7-11700K

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Ryzen 7 5800X3D compared with Core i7-11700K

	AMDRyzen 7 5800X3D	IntelCore i7-11700K
Overview
Released
Released	April 2022	March 2021
Cores and clocks
Cores
Cores	8	8
Threads
Threads	16	16
Base clock
Base clock	3.4 GHz	3.6 GHz
Boost clock
Boost clock	4.5 GHz	5 GHz (better)
L3 cache
L3 cache	96 MB (better)	16 MB
Cores
Cores	8 Zen 3 cores with simultaneous multithreading; codename Vermeer; 2 dies in the package	Hyper-Threading, Turbo Boost Max 3.0, AVX-512 and Deep Learning Boost supported. Thermal Velocity Boost is not supported. General retail sale began 30 March 2021, according to Intel's sales-embargo statement reported by Windows Central; the 16 March maker press release was the announcement.
Clocks
Clocks	–	Up to 5 GHz with Turbo Boost Max 3.0, or 4.9 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3.1 GHz base clock. Tom's Hardware reports 251 W PL2; the current Intel specification page publishes TDP only.
Cache
Cache	L1 512 KB, L2 4 MB, L3 96 MB	–
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	None; a graphics card is required	Intel UHD Graphics 750; 32 execution units; 350 MHz base, up to 1.3 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 60 Hz; DisplayPort up to 5120×3200 at 60 Hz; Quick Sync Video supported.
AI engine
AI engine	–	Intel Gaussian & Neural Accelerator 2.0; Deep Learning Boost on the CPU.
Platform
Socket
Socket	AM4	LGA1200
Base power
Base power	105 W	125 W
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR4, 2 channels, up to 128 GB (UDIMM); DDR4-3200 with 2 modules, DDR4-2933 (1 rank), DDR4-2667 (2 rank) with 4; ECC with motherboard support	Up to 128 GB; two channels; DDR4-3200; 50 GB/s maximum bandwidth; ECC not supported. Tom's Hardware reports official Gear 1 support to DDR4-2933, with DDR4-3200 using Gear 2; its review tests faster Gear 1 settings as memory overclocking.
PCIe
PCIe	PCIe 4.0; 24 lanes (20 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps)	PCIe 4.0; 20 CPU lanes, configured as 1×16+1×4, 2×8+1×4 or 1×8+3×4.
Chipsets
Chipsets	X570, X470, B550, B450, A520	–
Process
Process	TSMC 7nm FinFET (CPU cores), 12nm (Globalfoundries) (I/O die)	14 nm; Rocket Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Cypress Cove CPU architecture (Intel launch announcement).
Cooler
Cooler	Not included; Liquid cooler recommended for optimal performance; Tjmax 90°C	No cooler included with the boxed processor (Tom's Hardware exact-model review). The photograph shows its labelled preproduction review sample installed in a motherboard.