AMD Ryzen 9 7900 vs Intel Core i5-14500

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Ryzen 9 7900 compared with Core i5-14500

	AMDRyzen 9 7900	IntelCore i5-14500
Overview
Released
Released	January 2023	January 2024
Cores and clocks
Cores
Cores	12	14 (6 performance, 8 efficiency) (better)
Threads
Threads	24 (better)	20
Base clock
Base clock	3.7 GHz	2.6 GHz
Boost clock
Boost clock	5.4 GHz (better)	5 GHz
L3 cache
L3 cache	64 MB (better)	24 MB
Cores
Cores	Zen 4; Raphael; 3 package dies; simultaneous multithreading	6 P-cores and 8 E-cores; 20 threads. ComputerBase identifies its tested sample as C0 Alder Lake silicon within the marketed Raptor Lake Refresh generation.
Clocks
Clocks	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported; first availability 10 January 2023 in AMD's launch release, although the current product page lists 14 January	P-cores: 2.6 GHz base, up to 5.0 GHz turbo. E-cores: 1.9 GHz base, up to 3.7 GHz turbo.
Cache
Cache	L1 768 KB; L2 12 MB; L3 64 MB	24 MB Intel Smart Cache (L3); 11.5 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported	Intel UHD Graphics 770; 32 execution units; up to 1.55 GHz; Quick Sync Video; up to four displays.
Platform
Socket
Socket	AM5	LGA1700
Base power
Base power	65 W	65 W
Maximum power
Maximum power	–	154 W
Unlocked
Unlocked	Yes	No
Cooler in the box
Cooler in the box	Yes	Yes
Memory support
Memory support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported	Up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s; ECC supported with an appropriate platform.
PCIe
PCIe	PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports	PCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850	Intel 600- and 700-series motherboards; appropriate BIOS support required.
Process
Process	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²	Intel 7; Raptor Lake Refresh generation. ComputerBase identifies the tested sample as C0 Alder Lake silicon. 45 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	AMD Wraith Prism; Tjmax 95°C; bundled cooler confirmed in AMD launch release, omitted from the current technical page	Intel Laminar RM1 included with the boxed processor (Intel support).