AMD Ryzen 9 7900X3D vs AMD Ryzen 9 7950X3D

Every spec side by side, from each maker's published figures.

Only show differences

Better figure, where one is clearly better

Share comparison

Ryzen 9 7900X3D compared with Ryzen 9 7950X3D

	AMDRyzen 9 7900X3D	AMDRyzen 9 7950X3D
Overview
Released
Released	February 2023	February 2023
Cores and clocks
Cores
Cores	12	16 (better)
Threads
Threads	24	32 (better)
Base clock
Base clock	4.4 GHz	4.2 GHz
Boost clock
Boost clock	5.6 GHz	5.7 GHz (better)
L3 cache
L3 cache	128 MB	128 MB
Cores
Cores	Zen 4; Raphael; 3 package dies; simultaneous multithreading; two compute chiplets with 6 active cores each, one with 3D V-Cache (Tom's Hardware)	Zen 4; Raphael; 3 package dies; simultaneous multithreading; two compute chiplets with 8 active cores each, one with 3D V-Cache (PC Gamer)
Clocks
Clocks	Direct CPU frequency overclocking is disabled; Precision Boost Overdrive, Curve Optimizer and memory tuning are supported (Tom's Hardware). AMD product launch date 28 February 2023 is corroborated as retail release by TechRadar	Direct CPU overclocking is disabled; Precision Boost Overdrive and Curve Optimizer tuning remain supported (PC Gamer). AMD product launch date 28 February 2023 is corroborated as first sale by KitGuru
Cache
Cache	L1 768 KB; L2 12 MB; L3 128 MB; 96 MB L3 on the cache chiplet and 32 MB on the other (Tom's Hardware)	L1 1024 KB; L2 16 MB; L3 128 MB; 96 MB L3 on the cache chiplet and 32 MB on the other (KitGuru)
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported
Platform
Socket
Socket	AM5	AM5
Base power
Base power	120 W	120 W
Unlocked
Unlocked	No	No
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported
PCIe
PCIe	PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports	PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850
Process
Process	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²
Cooler
Cooler	Not included; Tjmax 89°C; AMD recommends liquid cooling for optimal performance	Not included; Tjmax 89°C; AMD recommends liquid cooling for optimal performance