AMD Ryzen 9 7900X3D vs Intel Core i5-14600K

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Ryzen 9 7900X3D compared with Core i5-14600K

	AMDRyzen 9 7900X3D	IntelCore i5-14600K
Overview
Released
Released	February 2023	October 2023
Cores and clocks
Cores
Cores	12	14 (6 performance, 8 efficiency) (better)
Threads
Threads	24 (better)	20
Base clock
Base clock	4.4 GHz	3.5 GHz
Boost clock
Boost clock	5.6 GHz (better)	5.3 GHz
L3 cache
L3 cache	128 MB (better)	24 MB
Cores
Cores	Zen 4; Raphael; 3 package dies; simultaneous multithreading; two compute chiplets with 6 active cores each, one with 3D V-Cache (Tom's Hardware)	6 Performance-cores and 8 Efficient-cores, with Hyper-Threading; codename Raptor Lake
Clocks
Clocks	Direct CPU frequency overclocking is disabled; Precision Boost Overdrive, Curve Optimizer and memory tuning are supported (Tom's Hardware). AMD product launch date 28 February 2023 is corroborated as retail release by TechRadar	P-core base 3.5 GHz, max turbo 5.3 GHz; E-core base 2.6 GHz, max turbo 4 GHz
Cache
Cache	L1 768 KB; L2 12 MB; L3 128 MB; 96 MB L3 on the cache chiplet and 32 MB on the other (Tom's Hardware)	24 MB Intel Smart Cache (L3); 20 MB L2
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported	Intel UHD Graphics 770, 32 execution units, up to 1.55 GHz; outputs eDP 1.4b, DP 1.4a, HDMI 2.1; up to 4 displays
Platform
Socket
Socket	AM5	LGA1700
Base power
Base power	120 W	125 W
Maximum power
Maximum power	–	181 W
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	No	–
Memory support
Memory support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported	Up to DDR5 5600 MT/s or up to DDR4 3200 MT/s; 2 channels, up to 192 GB; ECC supported
PCIe
PCIe	PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports	PCIe 5.0 and 4.0; 20 lanes (Up to 1x16+4, 2x8+4); DMI 4.0 x8
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850	Intel 600 and 700 series
Process
Process	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²	Intel 7
Cooler
Cooler	Not included; Tjmax 89°C; AMD recommends liquid cooling for optimal performance	max operating temperature 100 °C; thermal specification PCG 2020A