AMD Ryzen Threadripper 1950X vs Intel Core i9-9960X

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Ryzen Threadripper 1950X compared with Core i9-9960X

	AMDRyzen Threadripper 1950X	IntelCore i9-9960X
Overview
Released
Released	August 2017	2018
Cores and clocks
Cores
Cores	16	16
Threads
Threads	32	32
Base clock
Base clock	3.4 GHz	3.1 GHz
Boost clock
Boost clock	4 GHz	4.5 GHz (better)
L3 cache
L3 cache	32 MB (better)	22 MB
Cores
Cores	Zen architecture; boxed product ID YD195XA8AEWOF. AMD's support page lists 31 July 2017, when pre-orders began; its press release confirms on-shelf availability on 10 August 2017, used here.	Skylake-X refresh; Hyper-Threading and an unlocked multiplier, confirmed by Intel’s exact-model launch table.
Clocks
Clocks	Precision Boost and XFR supported; AMD states up to 4.2 GHz with XFR under suitable cooling, separate from the published 4.0 GHz maximum boost	Turbo Boost Max 3.0 up to 4.50 GHz on the preferred cores; ordinary Turbo Boost 2.0 up to 4.40 GHz. Intel planned November 2018 availability. ASCII’s contemporary report confirms Japanese retail sale on 21 December 2018, but earlier worldwide sale was not established; year precision is retained.
Cache
Cache	L1 1536 KB; L2 8 MB	22 MB Intel Smart Cache; L3 designation confirmed by the exact Newegg listing.
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	A separate graphics card is required	No processor graphics, explicitly confirmed by Intel’s exact-model support table.
Platform
Socket
Socket	sTR4	LGA2066
Base power
Base power	180 W	165 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR4; four channels; up to 2667 MT/s	Up to 128 GB; four channels of DDR 4-2666; 85 GB/s maximum published bandwidth; no ECC.
PCIe
PCIe	PCIe 3.0; 64 lanes	44 CPU lanes; PCIe 3.0. The 68-lane family platform figure includes chipset lanes.
Chipsets
Chipsets	–	Intel X 299; LGA 2066.
Process
Process	14 nm	14 nm; Skylake-X refresh.
Cooler
Cooler	No cooler included; maximum operating temperature 68°C	Intel explicitly excludes a fan and heatsink from the boxed product. Intel’s support article confirms solder thermal interface material for this exact model; published junction limit 85°C.