Intel Core 2 Duo E6600 vs Intel Core i7-14700K
Better figure, where one is clearly better
| IntelCore 2 Duo E6600 | IntelCore i7-14700K | |
|---|---|---|
| Overview | ||
| Released | July 2006 | October 2023 |
| Cores and clocks | ||
| Cores | 2 | 20 (8 performance, 12 efficiency) (better) |
| Threads | 2 | 28 (better) |
| Base clock | 2.4 GHz | 3.4 GHz |
| Boost clock | – | 5.6 GHz |
| L3 cache | – | 33 MB |
| Cores | Conroe; two cores and two threads, without Hyper-Threading. | 8 Performance-cores and 12 Efficient-cores, with Hyper-Threading; codename Raptor Lake |
| Clocks | Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel unveiled the family on 27 July 2006 and said complete Core 2 Duo desktop systems would arrive in early August. TechSpot’s 2 August review says boxed CPUs began shipping late the previous week, supporting July CPU availability without an exact sale day. No unpublished boost figure is supplied. | P-core base 3.4 GHz, max turbo 5.5 GHz; E-core base 2.5 GHz, max turbo 4.3 GHz; Turbo Boost Max 3.0 5.6 GHz |
| Cache | 4 MB shared L2 cache, as Intel’s datasheet states; no L3 figure supplied. | 33 MB Intel Smart Cache (L3); 28 MB L2 |
| Graphics and AI | ||
| Built-in graphics | No | Yes |
| Graphics | No integrated graphics, explicitly confirmed by the exact-model CPU-Monkey specification entry. Chipset graphics are separate from the processor. | Intel UHD Graphics 770, 32 execution units, up to 1.6 GHz; outputs eDP 1.4b, DP 1.4a, HDMI 2.1; up to 4 displays |
| Platform | ||
| Socket | LGA775 | LGA1700 |
| Base power | 65 W | 125 W |
| Maximum power | – | 253 W |
| Unlocked | – | Yes |
| Cooler in the box | Yes | – |
| Memory support | Intel’s datasheet routes memory and I/O transactions through the front-side bus and chipset; memory types and capacity depend on the motherboard. | Up to DDR5 5600 MT/s or up to DDR4 3200 MT/s; 2 channels, up to 192 GB; ECC supported |
| PCIe | – | PCIe 5.0 and 4.0; 20 lanes (Up to 1x16+4, 2x8+4); DMI 4.0 x8 |
| Chipsets | – | Intel 600 and 700 series |
| Process | 65 nm; Conroe; LGA775. | Intel 7 |
| Cooler | Intel’s boxed-processor specification confirms an unattached fan heatsink. Published processor TDP is 65 W. | max operating temperature 100 °C; thermal specification PCG 2020A |
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