Intel Core 2 Duo E6600 vs Intel Core i5-14500

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Core 2 Duo E6600 compared with Core i5-14500

	IntelCore 2 Duo E6600	IntelCore i5-14500
Overview
Released
Released	July 2006	January 2024
Cores and clocks
Cores
Cores	2	14 (6 performance, 8 efficiency) (better)
Threads
Threads	2	20 (better)
Base clock
Base clock	2.4 GHz	2.6 GHz
Boost clock
Boost clock	–	5 GHz
L3 cache
L3 cache	–	24 MB
Cores
Cores	Conroe; two cores and two threads, without Hyper-Threading.	6 P-cores and 8 E-cores; 20 threads. ComputerBase identifies its tested sample as C0 Alder Lake silicon within the marketed Raptor Lake Refresh generation.
Clocks
Clocks	Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel unveiled the family on 27 July 2006 and said complete Core 2 Duo desktop systems would arrive in early August. TechSpot’s 2 August review says boxed CPUs began shipping late the previous week, supporting July CPU availability without an exact sale day. No unpublished boost figure is supplied.	P-cores: 2.6 GHz base, up to 5.0 GHz turbo. E-cores: 1.9 GHz base, up to 3.7 GHz turbo.
Cache
Cache	4 MB shared L2 cache, as Intel’s datasheet states; no L3 figure supplied.	24 MB Intel Smart Cache (L3); 11.5 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics, explicitly confirmed by the exact-model CPU-Monkey specification entry. Chipset graphics are separate from the processor.	Intel UHD Graphics 770; 32 execution units; up to 1.55 GHz; Quick Sync Video; up to four displays.
Platform
Socket
Socket	LGA775	LGA1700
Base power
Base power	65 W	65 W
Maximum power
Maximum power	–	154 W
Unlocked
Unlocked	–	No
Cooler in the box
Cooler in the box	Yes	Yes
Memory support
Memory support	Intel’s datasheet routes memory and I/O transactions through the front-side bus and chipset; memory types and capacity depend on the motherboard.	Up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s; ECC supported with an appropriate platform.
PCIe
PCIe	–	PCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	–	Intel 600- and 700-series motherboards; appropriate BIOS support required.
Process
Process	65 nm; Conroe; LGA775.	Intel 7; Raptor Lake Refresh generation. ComputerBase identifies the tested sample as C0 Alder Lake silicon. 45 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	Intel’s boxed-processor specification confirms an unattached fan heatsink. Published processor TDP is 65 W.	Intel Laminar RM1 included with the boxed processor (Intel support).