Intel Core 2 Duo E8400 vs Intel Core i5-12600K

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Core 2 Duo E8400 compared with Core i5-12600K

	IntelCore 2 Duo E8400	IntelCore i5-12600K
Overview
Released
Released	January 2008	November 2021
Cores and clocks
Cores
Cores	2	10 (6 performance, 4 efficiency) (better)
Threads
Threads	2	16 (better)
Base clock
Base clock	3 GHz	3.7 GHz
Boost clock
Boost clock	–	4.9 GHz
L3 cache
L3 cache	–	20 MB
Cores
Cores	Wolfdale; two cores and two threads, without Hyper-Threading. Intel’s archived exact E8400 specifications are attached to the maker datasheet distributed by Mouser.	6 P-cores and4 E-cores; P-core Hyper-Threading;16threads. ThreadDirector supported.
Clocks
Clocks	Published operating frequency 3.00 GHz; 1333 MHz front-side bus. Intel explicitly lists no Turbo Boost, so no boost figure is supplied. Intel’s CES fact sheet specifies January 2008 availability for this exact model; TechSpot’s 1 February review confirms retail stock, with early shortages and prices above target. An exact first-sale day remains unverified.	P-cores3.7GHzbase/up4.9GHz turbo;E-cores2.8GHzbase/up3.6GHz turbo. TurboBoost2.0; noTurboBoostMax3.0.
Cache
Cache	6 MB shared L2 cache; no L3 figure supplied.	20MBIntelSmartCache(L3);9.5MBtotalL2.
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics, explicitly confirmed by the exact BX80570E8400 Newegg listing; motherboard graphics are separate.	IntelUHDGraphics770;32executionunits;300MHzbase/up1.45GHz;QuickSyncVideo;up4displays.
Platform
Socket
Socket	LGA775	LGA1700
Base power
Base power	65 W	125 W
Maximum power
Maximum power	–	150 W
Unlocked
Unlocked	–	Yes
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	Memory and I/O transactions pass through the front-side bus and chipset, as Intel’s datasheet states; supported memory types and capacity depend on the motherboard.	Up to 128 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s; ECC supported with an appropriate platform.
PCIe
PCIe	–	PCIe 5.0 and 4.0; 20 CPU lanes: 1 × 16 + 4 or 2 × 8 + 4; DMI 4.0 × 8.
Process
Process	45 nm; Wolfdale; LGA775; SSE4.1 support.	Intel 7; Alder Lake; 45 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	Intel’s boxed-processor specification confirms a supplied cooling solution; exact BX80570E8400 listing confirms heatsink and fan. Published processor TDP is 65 W.	No cooler included with the boxed K processor (Intel support).