Intel Core 2 Duo E8400 vs Intel Core i5-14500

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Core 2 Duo E8400 compared with Core i5-14500

	IntelCore 2 Duo E8400	IntelCore i5-14500
Overview
Released
Released	January 2008	January 2024
Cores and clocks
Cores
Cores	2	14 (6 performance, 8 efficiency) (better)
Threads
Threads	2	20 (better)
Base clock
Base clock	3 GHz	2.6 GHz
Boost clock
Boost clock	–	5 GHz
L3 cache
L3 cache	–	24 MB
Cores
Cores	Wolfdale; two cores and two threads, without Hyper-Threading. Intel’s archived exact E8400 specifications are attached to the maker datasheet distributed by Mouser.	6 P-cores and 8 E-cores; 20 threads. ComputerBase identifies its tested sample as C0 Alder Lake silicon within the marketed Raptor Lake Refresh generation.
Clocks
Clocks	Published operating frequency 3.00 GHz; 1333 MHz front-side bus. Intel explicitly lists no Turbo Boost, so no boost figure is supplied. Intel’s CES fact sheet specifies January 2008 availability for this exact model; TechSpot’s 1 February review confirms retail stock, with early shortages and prices above target. An exact first-sale day remains unverified.	P-cores: 2.6 GHz base, up to 5.0 GHz turbo. E-cores: 1.9 GHz base, up to 3.7 GHz turbo.
Cache
Cache	6 MB shared L2 cache; no L3 figure supplied.	24 MB Intel Smart Cache (L3); 11.5 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics, explicitly confirmed by the exact BX80570E8400 Newegg listing; motherboard graphics are separate.	Intel UHD Graphics 770; 32 execution units; up to 1.55 GHz; Quick Sync Video; up to four displays.
Platform
Socket
Socket	LGA775	LGA1700
Base power
Base power	65 W	65 W
Maximum power
Maximum power	–	154 W
Unlocked
Unlocked	–	No
Cooler in the box
Cooler in the box	Yes	Yes
Memory support
Memory support	Memory and I/O transactions pass through the front-side bus and chipset, as Intel’s datasheet states; supported memory types and capacity depend on the motherboard.	Up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s; ECC supported with an appropriate platform.
PCIe
PCIe	–	PCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	–	Intel 600- and 700-series motherboards; appropriate BIOS support required.
Process
Process	45 nm; Wolfdale; LGA775; SSE4.1 support.	Intel 7; Raptor Lake Refresh generation. ComputerBase identifies the tested sample as C0 Alder Lake silicon. 45 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	Intel’s boxed-processor specification confirms a supplied cooling solution; exact BX80570E8400 listing confirms heatsink and fan. Published processor TDP is 65 W.	Intel Laminar RM1 included with the boxed processor (Intel support).