Intel Core 2 Duo E8400 vs Intel Core i7-4770K

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Core 2 Duo E8400 compared with Core i7-4770K

	IntelCore 2 Duo E8400	IntelCore i7-4770K
Overview
Released
Released	January 2008	June 2013
Cores and clocks
Cores
Cores	2	4 (better)
Threads
Threads	2	8 (better)
Base clock
Base clock	3 GHz	3.5 GHz
Boost clock
Boost clock	–	3.9 GHz
L3 cache
L3 cache	–	8 MB
Cores
Cores	Wolfdale; two cores and two threads, without Hyper-Threading. Intel’s archived exact E8400 specifications are attached to the maker datasheet distributed by Mouser.	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported. The unlocked multiplier is confirmed by Expert Reviews and TechRadar. Current Intel specifications list TSX and VT-d as unsupported.
Clocks
Clocks	Published operating frequency 3.00 GHz; 1333 MHz front-side bus. Intel explicitly lists no Turbo Boost, so no boost figure is supplied. Intel’s CES fact sheet specifies January 2008 availability for this exact model; TechSpot’s 1 February review confirms retail stock, with early shortages and prices above target. An exact first-sale day remains unverified.	Maximum turbo is a single-core frequency; sustained clocks depend on cooling and motherboard settings. Intel's June 2013 availability notice and Puget Systems' June launch lineup establish the sale month; they do not establish a worldwide first-sale day.
Cache
Cache	6 MB shared L2 cache; no L3 figure supplied.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics, explicitly confirmed by the exact BX80570E8400 Newegg listing; motherboard graphics are separate.	Intel HD Graphics 4600; 350 MHz base, up to 1.25 GHz; three displays; Quick Sync Video.
Platform
Socket
Socket	LGA775	LGA1150
Base power
Base power	65 W	84 W
Unlocked
Unlocked	–	Yes
Cooler in the box
Cooler in the box	Yes	–
Memory support
Memory support	Memory and I/O transactions pass through the front-side bus and chipset, as Intel’s datasheet states; supported memory types and capacity depend on the motherboard.	Up to 32 GB; two channels; DDR3-1333/1600 and DDR3L-1333/1600 at 1.5 V; 25.6 GB/s maximum bandwidth; ECC not supported.
PCIe
PCIe	–	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.
Process
Process	45 nm; Wolfdale; LGA775; SSE4.1 support.	22 nm; Haswell; 37.5 × 37.5 mm package; 72.72°C maximum case temperature, not junction temperature.
Cooler
Cooler	Intel’s boxed-processor specification confirms a supplied cooling solution; exact BX80570E8400 listing confirms heatsink and fan. Published processor TDP is 65 W.	Requires an LGA1150 motherboard; earlier LGA1155 processors use a different socket. No separate maximum turbo-power figure is published in the current Intel specifications.