Intel Core i3-13100F vs Intel Core i5-750

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Core i3-13100F compared with Core i5-750

	IntelCore i3-13100F	IntelCore i5-750
Overview
Released
Released	January 2023	September 2009
Cores and clocks
Cores
Cores	4 (4 performance, 0 efficiency)	4
Threads
Threads	8 (better)	4
Base clock
Base clock	3.4 GHz	2.66 GHz
Boost clock
Boost clock	4.5 GHz (better)	3.2 GHz
L3 cache
L3 cache	12 MB (better)	8 MB
Cores
Cores	Four P-cores and no E-cores; Hyper-Threading supported.	Four cores and four threads; Hyper-Threading is absent. TechRadar's exact Core i5-750 overclocking guide confirms the CPU multiplier is locked; base-clock overclocking remains possible.
Clocks
Clocks	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.	Up to 3.20 GHz Turbo Boost. Intel's embedded product brief specifies 3.20 GHz with one or two active cores and 2.80 GHz with four; actual behaviour depends on workload, cooling and platform limits.
Cache
Cache	12 MB Intel Smart Cache (L3); 5 MB total L2.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	No processor graphics; Intel's desktop comparison chart lists graphics as not applicable. A separate graphics solution is required.
AI engine
AI engine	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.	–
Platform
Socket
Socket	LGA1700	LGA1156
Base power
Base power	58 W	95 W
Maximum power
Maximum power	110 W	–
Unlocked
Unlocked	No	No
Cooler in the box
Cooler in the box	Yes	–
Memory support
Memory support	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.	Two channels of DDR3-1066/1333. Optional maximum memory capacity and bandwidth are omitted because the retired exact-model specification page could not be read.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.	16 processor PCIe 2.0 lanes, configurable as one ×16 or two ×8 graphics links. A separate DMI link connects the processor to the chipset.
Process
Process	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.	45 nm; Lynnfield, based on the Nehalem architecture.
Cooler
Cooler	Boxed retail processor includes Intel Laminar RM1 (Intel support).	LGA1156 platform, distinct from LGA775 and LGA1366. Intel's 8 September 2009 notice names the 750 and says the new processors and P55 chipset are available that day. Cooler inclusion and package temperature are omitted where maker evidence is unavailable.