Intel Core i3-13100F vs Intel Core i7-5960X

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Core i3-13100F compared with Core i7-5960X

	IntelCore i3-13100F	IntelCore i7-5960X
Overview
Released
Released	January 2023	August 2014
Cores and clocks
Cores
Cores	4 (4 performance, 0 efficiency)	8 (better)
Threads
Threads	8	16 (better)
Base clock
Base clock	3.4 GHz	3 GHz
Boost clock
Boost clock	4.5 GHz (better)	3.5 GHz
L3 cache
L3 cache	12 MB	20 MB (better)
Cores
Cores	Four P-cores and no E-cores; Hyper-Threading supported.	Haswell-E; 8 cores with Hyper-Threading. The unlocked multiplier is confirmed by the exact-model reviews.
Clocks
Clocks	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.	Turbo Boost 2.0 up to 3.50 GHz. August release month follows PCWorld’s 29 August report that Intel was shipping the models and TechSpot’s same-day expected retail availability. Intel’s 29 August notice instead says the three SKUs will be available next week; an exact maker first-sale day is unresolved.
Cache
Cache	12 MB Intel Smart Cache (L3); 5 MB total L2.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	No processor graphics, confirmed by Intel’s exact-model comparison-chart row; a separate graphics solution is required.
AI engine
AI engine	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.	–
Platform
Socket
Socket	LGA1700	LGA2011-v3
Base power
Base power	58 W	140 W
Maximum power
Maximum power	110 W	–
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.	Up to 64 GB; four channels of DDR4-1600/1866/2133; maximum bandwidth 68 GB/s; no ECC.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.	40 CPU lanes; PCIe 3.0
Chipsets
Chipsets	–	X99 and LGA2011-v3, distinguished by Intel’s exact-model comparison chart and the reviews. Current ARK abbreviates the socket as FCLGA2011; this is not compatible with the older X79 LGA2011 platform.
Process
Process	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.	22 nm; Haswell-E. Package size 52.5 × 45.0 mm.
Cooler
Cooler	Boxed retail processor includes Intel Laminar RM1 (Intel support).	Intel explicitly excludes a fan and heatsink from the boxed product; a separate compatible cooler is required.