Intel Core i3-13100F vs Intel Core i7-7740X

Every spec side by side, from each maker's published figures.

Better figure, where one is clearly better

Core i3-13100F compared with Core i7-7740X
IntelCore i3-13100FIntelCore i7-7740X
Overview
ReleasedJanuary 2023June 2017
Cores and clocks
Cores4 (4 performance, 0 efficiency)4
Threads88
Base clock3.4 GHz4.3 GHz
Boost clock4.5 GHz4.5 GHz
L3 cache12 MB (better)8 MB
CoresFour P-cores and no E-cores; Hyper-Threading supported.Kaby Lake-X with Hyper-Threading; unlocked core multiplier confirmed by KitGuru’s exact-model technical table and overclocking test.
ClocksCPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.Turbo Boost 2.0 up to 4.50 GHz; no Turbo Boost Max 3.0 in Intel’s exact comparison-chart row. Intel’s press-kit record names 26 June 2017 availability for the first Core X processors, and its August record confirms the four- to ten-core models were already on shelves; conservative month precision is retained.
Cache12 MB Intel Smart Cache (L3); 5 MB total L2.8 MB cache; L3 designation confirmed by KitGuru’s exact-model table.
Graphics and AI
Built-in graphicsNoNo
GraphicsNo integrated graphics; a separate graphics card is required (Intel support).No processor graphics, explicitly confirmed by Intel’s exact-model comparison chart.
AI engineIntel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.–
Platform
SocketLGA1700LGA2066
Base power58 W112 W
Maximum power110 W–
UnlockedNoYes
Cooler in the boxYesNo
Memory supportCurrent Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.Up to 64 GB; two channels of DDR4-2666; 42 GB/s maximum published bandwidth; no ECC.
PCIePCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.16 CPU PCIe lanes; up to 1×16, 2×8 or 1×8 plus 2×4.
Chipsets–Intel X299; LGA2066.
ProcessIntel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.14 nm; Kaby Lake-X.
CoolerBoxed retail processor includes Intel Laminar RM1 (Intel support).Intel excludes a fan and heatsink from the boxed product; junction limit 100°C.

More comparisons