Intel Core i5-14500 vs Intel Core i7-7740X

Every spec side by side, from each maker's published figures.

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Core i5-14500 compared with Core i7-7740X
IntelCore i5-14500IntelCore i7-7740X
Overview
ReleasedJanuary 2024June 2017
Cores and clocks
Cores14 (6 performance, 8 efficiency) (better)4
Threads20 (better)8
Base clock2.6 GHz4.3 GHz
Boost clock5 GHz (better)4.5 GHz
L3 cache24 MB (better)8 MB
Cores6 P-cores and 8 E-cores; 20 threads. ComputerBase identifies its tested sample as C0 Alder Lake silicon within the marketed Raptor Lake Refresh generation.Kaby Lake-X with Hyper-Threading; unlocked core multiplier confirmed by KitGuru’s exact-model technical table and overclocking test.
ClocksP-cores: 2.6 GHz base, up to 5.0 GHz turbo. E-cores: 1.9 GHz base, up to 3.7 GHz turbo.Turbo Boost 2.0 up to 4.50 GHz; no Turbo Boost Max 3.0 in Intel’s exact comparison-chart row. Intel’s press-kit record names 26 June 2017 availability for the first Core X processors, and its August record confirms the four- to ten-core models were already on shelves; conservative month precision is retained.
Cache24 MB Intel Smart Cache (L3); 11.5 MB total L2.8 MB cache; L3 designation confirmed by KitGuru’s exact-model table.
Graphics and AI
Built-in graphicsYesNo
GraphicsIntel UHD Graphics 770; 32 execution units; up to 1.55 GHz; Quick Sync Video; up to four displays.No processor graphics, explicitly confirmed by Intel’s exact-model comparison chart.
Platform
SocketLGA1700LGA2066
Base power65 W112 W
Maximum power154 W–
UnlockedNoYes
Cooler in the boxYesNo
Memory supportUp to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s; ECC supported with an appropriate platform.Up to 64 GB; two channels of DDR4-2666; 42 GB/s maximum published bandwidth; no ECC.
PCIePCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.16 CPU PCIe lanes; up to 1×16, 2×8 or 1×8 plus 2×4.
ChipsetsIntel 600- and 700-series motherboards; appropriate BIOS support required.Intel X299; LGA2066.
ProcessIntel 7; Raptor Lake Refresh generation. ComputerBase identifies the tested sample as C0 Alder Lake silicon. 45 × 37.5 mm package; 100°C maximum junction temperature.14 nm; Kaby Lake-X.
CoolerIntel Laminar RM1 included with the boxed processor (Intel support).Intel excludes a fan and heatsink from the boxed product; junction limit 100°C.

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