Intel Core i3-13100F vs Intel Core i7-8700K

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Core i3-13100F compared with Core i7-8700K

	IntelCore i3-13100F	IntelCore i7-8700K
Overview
Released
Released	January 2023	October 2017
Cores and clocks
Cores
Cores	4 (4 performance, 0 efficiency)	6 (better)
Threads
Threads	8	12 (better)
Base clock
Base clock	3.4 GHz	3.7 GHz
Boost clock
Boost clock	4.5 GHz	4.7 GHz (better)
L3 cache
L3 cache	12 MB	12 MB
Cores
Cores	Four P-cores and no E-cores; Hyper-Threading supported.	6 cores and 12 threads; Coffee Lake architecture; multiplier unlocked.
Clocks
Clocks	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.	3.7 GHz base; up to 4.7 GHz Intel Turbo Boost 2.0.
Cache
Cache	12 MB Intel Smart Cache (L3); 5 MB total L2.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; Quick Sync Video; up to three displays.
AI engine
AI engine	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.	–
Platform
Socket
Socket	LGA1700	LGA1151
Base power
Base power	58 W	95 W
Maximum power
Maximum power	110 W	–
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.	Up to 128 GB on the current Intel specification page; two channels; DDR4-2666; 41.6 GB/s; ECC not supported.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.	PCIe 3.0; 16 CPU lanes: 1 × 16, 2 × 8 or 1 × 8 + 2 × 4. This excludes chipset lanes.
Chipsets
Chipsets	–	Intel 300-series motherboards; Z370 at launch. Older 100- and 200-series boards are incompatible despite sharing the LGA1151 socket (TechPowerUp and PC Gamer).
Process
Process	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.	14 nm; 37.5 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	Boxed retail processor includes Intel Laminar RM1 (Intel support).	No fan or heatsink included with the boxed processor (Intel specifications).