Intel Core i3-13100F vs Intel Core i9-9960X

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Core i3-13100F compared with Core i9-9960X

	IntelCore i3-13100F	IntelCore i9-9960X
Overview
Released
Released	January 2023	2018
Cores and clocks
Cores
Cores	4 (4 performance, 0 efficiency)	16 (better)
Threads
Threads	8	32 (better)
Base clock
Base clock	3.4 GHz	3.1 GHz
Boost clock
Boost clock	4.5 GHz	4.5 GHz
L3 cache
L3 cache	12 MB	22 MB (better)
Cores
Cores	Four P-cores and no E-cores; Hyper-Threading supported.	Skylake-X refresh; Hyper-Threading and an unlocked multiplier, confirmed by Intel’s exact-model launch table.
Clocks
Clocks	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.	Turbo Boost Max 3.0 up to 4.50 GHz on the preferred cores; ordinary Turbo Boost 2.0 up to 4.40 GHz. Intel planned November 2018 availability. ASCII’s contemporary report confirms Japanese retail sale on 21 December 2018, but earlier worldwide sale was not established; year precision is retained.
Cache
Cache	12 MB Intel Smart Cache (L3); 5 MB total L2.	22 MB Intel Smart Cache; L3 designation confirmed by the exact Newegg listing.
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	No processor graphics, explicitly confirmed by Intel’s exact-model support table.
AI engine
AI engine	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.	–
Platform
Socket
Socket	LGA1700	LGA2066
Base power
Base power	58 W	165 W
Maximum power
Maximum power	110 W	–
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.	Up to 128 GB; four channels of DDR 4-2666; 85 GB/s maximum published bandwidth; no ECC.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.	44 CPU lanes; PCIe 3.0. The 68-lane family platform figure includes chipset lanes.
Chipsets
Chipsets	–	Intel X 299; LGA 2066.
Process
Process	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.	14 nm; Skylake-X refresh.
Cooler
Cooler	Boxed retail processor includes Intel Laminar RM1 (Intel support).	Intel explicitly excludes a fan and heatsink from the boxed product. Intel’s support article confirms solder thermal interface material for this exact model; published junction limit 85°C.