Intel Core i5-12400F vs Intel Core i5-750

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Core i5-12400F compared with Core i5-750

	IntelCore i5-12400F	IntelCore i5-750
Overview
Released
Released	January 2022	September 2009
Cores and clocks
Cores
Cores	6 (better)	4
Threads
Threads	12 (better)	4
Base clock
Base clock	2.5 GHz	2.66 GHz
Boost clock
Boost clock	4.4 GHz (better)	3.2 GHz
L3 cache
L3 cache	18 MB (better)	8 MB
Cores
Cores	6 P-cores and no E-cores; 12 threads. Intel Thread Director is not supported.	Four cores and four threads; Hyper-Threading is absent. TechRadar's exact Core i5-750 overclocking guide confirms the CPU multiplier is locked; base-clock overclocking remains possible.
Clocks
Clocks	2.5 GHz P-core base, up to 4.4 GHz P-core turbo; locked multiplier confirmed by io-tech and TechPowerUp.	Up to 3.20 GHz Turbo Boost. Intel's embedded product brief specifies 3.20 GHz with one or two active cores and 2.80 GHz with four; actual behaviour depends on workload, cooling and platform limits.
Cache
Cache	18 MB Intel Smart Cache (L3); 7.5 MB total L2.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel F-series support).	No processor graphics; Intel's desktop comparison chart lists graphics as not applicable. A separate graphics solution is required.
Platform
Socket
Socket	LGA1700	LGA1156
Base power
Base power	65 W	95 W
Maximum power
Maximum power	117 W	–
Unlocked
Unlocked	No	No
Cooler in the box
Cooler in the box	Yes	–
Memory support
Memory support	Up to 128 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth.	Two channels of DDR3-1066/1333. Optional maximum memory capacity and bandwidth are omitted because the retired exact-model specification page could not be read.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, up to 1×16+4 or 2×8+4; DMI 4.0 ×8.	16 processor PCIe 2.0 lanes, configurable as one ×16 or two ×8 graphics links. A separate DMI link connects the processor to the chipset.
Process
Process	Intel 7; Alder Lake; FCLGA1700, 45 × 37.5 mm package; 100°C Tjunction.	45 nm; Lynnfield, based on the Nehalem architecture.
Cooler
Cooler	Intel Laminar RM1 included with boxed retail processor (Intel support).	LGA1156 platform, distinct from LGA775 and LGA1366. Intel's 8 September 2009 notice names the 750 and says the new processors and P55 chipset are available that day. Cooler inclusion and package temperature are omitted where maker evidence is unavailable.