AMD Ryzen 5 8500G vs Intel Core i5-12400F

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Ryzen 5 8500G compared with Core i5-12400F

	AMDRyzen 5 8500G	IntelCore i5-12400F
Overview
Released
Released	January 2024	January 2022
Cores and clocks
Cores
Cores	6	6
Threads
Threads	12	12
Base clock
Base clock	3.5 GHz	2.5 GHz
Boost clock
Boost clock	5 GHz (better)	4.4 GHz
L3 cache
L3 cache	16 MB	18 MB (better)
Cores
Cores	Two Zen 4 and four Zen 4c cores; both support simultaneous multithreading. AMD names the family Phoenix; TechPowerUp identifies the smaller monolithic Phoenix 2 die.	6 P-cores and no E-cores; 12 threads. Intel Thread Director is not supported.
Clocks
Clocks	AMD lists 3.5 GHz overall base; Zen 4 base 4.1 GHz, boost up to 5 GHz; Zen 4c base 3.3 GHz, boost up to 3.7 GHz. CPU multiplier locked in TechPowerUp testing; Precision Boost Overdrive, Curve Optimizer and EXPO supported. Configurable TDP 45–65 W.	2.5 GHz P-core base, up to 4.4 GHz P-core turbo; locked multiplier confirmed by io-tech and TechPowerUp.
Cache
Cache	6 MB L2; 16 MB shared L3.	18 MB Intel Smart Cache (L3); 7.5 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	Radeon 740M; RDNA 3; four graphics cores at 2800 MHz; up to four displays; DisplayPort 2.1 and HDMI 2.1; hardware AV1 encode and decode.	No integrated graphics; a separate graphics card is required (Intel F-series support).
AI engine
AI engine	No dedicated Ryzen AI NPU (TechPowerUp and Phoronix).	–
Platform
Socket
Socket	AM5	LGA1700
Base power
Base power	65 W	65 W
Maximum power
Maximum power	–	117 W
Unlocked
Unlocked	No	No
Cooler in the box
Cooler in the box	–	Yes
Memory support
Memory support	DDR5 UDIMM; two channels; AMD lists maximum DDR5 capacity of 96 GB; ECC requires platform support. Two single- or dual-rank DIMMs: DDR5-5200; four single- or dual-rank DIMMs: DDR5-3600.	Up to 128 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth.
PCIe
PCIe	PCIe 4.0; 14 native lanes, 10 usable; graphics slot limited to ×4 (TechPowerUp). Two native USB4 40 Gbps, two USB 3.2 Gen 2 10 Gbps and one USB 2.0 port.	PCIe 5.0 and 4.0; 20 CPU lanes, up to 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	AMD lists A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850; motherboard firmware support required.	–
Process
Process	TSMC 4nm FinFET; 137 mm² CPU compute die; one package die.	Intel 7; Alder Lake; FCLGA1700, 45 × 37.5 mm package; 100°C Tjunction.
Cooler
Cooler	95°C maximum operating temperature. Retail review package includes an air cooler (TechPowerUp); check the exact retail or tray bundle.	Intel Laminar RM1 included with boxed retail processor (Intel support).