Intel Core i5-14400F vs Intel Core i7-9800X

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Core i5-14400F compared with Core i7-9800X

	IntelCore i5-14400F	IntelCore i7-9800X
Overview
Released
Released	January 2024	November 2018
Cores and clocks
Cores
Cores	10 (6 performance, 4 efficiency) (better)	8
Threads
Threads	16	16
Base clock
Base clock	2.5 GHz	3.8 GHz
Boost clock
Boost clock	4.7 GHz (better)	4.5 GHz
L3 cache
L3 cache	20 MB (better)	16.5 MB
Cores
Cores	6 Performance-cores and 4 Efficient-cores, with Hyper-Threading; codename Raptor Lake	Skylake-X refresh; Hyper-Threading and an unlocked multiplier, confirmed by Intel’s exact-model launch table.
Clocks
Clocks	P-core base 2.5 GHz, max turbo 4.7 GHz; E-core base 1.8 GHz, max turbo 3.5 GHz	Turbo Boost Max 3.0 up to 4.50 GHz on the preferred cores; ordinary Turbo Boost 2.0 up to 4.40 GHz. Intel’s October announcement states November availability; Kakaku lists November 2018 release for this exact model. The maker-confirmed exact first-sale day remains unverified.
Cache
Cache	20 MB Intel Smart Cache (L3); 9.5 MB L2	16.5 MB Intel Smart Cache; L3 designation confirmed by the exact Newegg listing.
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	None; a graphics card is required	No processor graphics, explicitly confirmed by Intel’s exact-model support table.
Platform
Socket
Socket	LGA1700	LGA2066
Base power
Base power	65 W	165 W
Maximum power
Maximum power	148 W	–
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	–	No
Memory support
Memory support	Up to DDR5 4800 MT/s or up to DDR4 3200 MT/s; 2 channels, up to 192 GB	Up to 128 GB; four channels of DDR4-2666; 85 GB/s maximum published bandwidth; no ECC.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 lanes (Up to 1x16+4, 2x8+4); DMI 4.0 x8	44 CPU lanes; PCIe 3.0. The 68-lane family platform figure includes chipset lanes.
Chipsets
Chipsets	–	Intel X299; LGA2066.
Process
Process	Intel 7	14 nm; Skylake-X refresh.
Cooler
Cooler	max operating temperature 100 °C; thermal specification PCG 2020C	Intel explicitly excludes a fan and heatsink from the boxed product. Intel’s support article confirms solder thermal interface material for this exact model; published junction limit 95°C.