Intel Core i5-14400F vs Intel Core i9-10900X

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Core i5-14400F compared with Core i9-10900X

	IntelCore i5-14400F	IntelCore i9-10900X
Overview
Released
Released	January 2024	2019
Cores and clocks
Cores
Cores	10 (6 performance, 4 efficiency)	10
Threads
Threads	16	20 (better)
Base clock
Base clock	2.5 GHz	3.7 GHz
Boost clock
Boost clock	4.7 GHz	4.7 GHz
L3 cache
L3 cache	20 MB (better)	19.25 MB
Cores
Cores	6 Performance-cores and 4 Efficient-cores, with Hyper-Threading; codename Raptor Lake	Cascade Lake-X; Hyper-Threading and an unlocked multiplier, confirmed by Intel’s exact-model family product brief.
Clocks
Clocks	P-core base 2.5 GHz, max turbo 4.7 GHz; E-core base 1.8 GHz, max turbo 3.5 GHz	Turbo Boost Max 3.0 up to 4.70 GHz on the preferred cores; ordinary Turbo Boost 2.0 up to 4.50 GHz. Intel targeted November 2019 availability, but first actual sale was not established in the bounded source pass; conservative year precision is retained.
Cache
Cache	20 MB Intel Smart Cache (L3); 9.5 MB L2	19.25 MB Intel Smart Cache; Intel’s exact-model product-brief table identifies it as L3 cache.
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	None; a graphics card is required	No processor graphics, explicitly confirmed by Intel’s exact-model support table.
AI engine
AI engine	–	Intel Deep Learning Boost provides CPU inference instructions; this is not a separate NPU.
Platform
Socket
Socket	LGA1700	LGA2066
Base power
Base power	65 W	165 W
Maximum power
Maximum power	148 W	–
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	–	No
Memory support
Memory support	Up to DDR5 4800 MT/s or up to DDR4 3200 MT/s; 2 channels, up to 192 GB	Up to 256 GB; four channels of DDR4-2933; 94 GB/s maximum published bandwidth; no ECC.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 lanes (Up to 1x16+4, 2x8+4); DMI 4.0 x8	48 CPU lanes; PCIe 3.0. The 72-lane family platform figure includes chipset lanes.
Chipsets
Chipsets	–	Intel X299; LGA2066.
Process
Process	Intel 7	14 nm; Cascade Lake-X.
Cooler
Cooler	max operating temperature 100 °C; thermal specification PCG 2020C	Intel explicitly excludes a fan and heatsink from the boxed product. Intel’s support article confirms solder thermal interface material for this exact model; published junction limit 94°C.