Intel Core i5-750 vs Intel Core i7-960
Better figure, where one is clearly better
| IntelCore i5-750 | IntelCore i7-960 | |
|---|---|---|
| Overview | ||
| Released | September 2009 | October 2009 |
| Cores and clocks | ||
| Cores | 4 | 4 |
| Threads | 4 | 8 (better) |
| Base clock | 2.66 GHz | 3.2 GHz |
| Boost clock | 3.2 GHz | 3.46 GHz (better) |
| L3 cache | 8 MB | 8 MB |
| Cores | Four cores and four threads; Hyper-Threading is absent. TechRadar's exact Core i5-750 overclocking guide confirms the CPU multiplier is locked; base-clock overclocking remains possible. | Four cores and eight threads with Hyper-Threading. Hardware-Magazin's exact-model introduction explicitly describes a fixed multiplier; base-clock overclocking remains possible. |
| Clocks | Up to 3.20 GHz Turbo Boost. Intel's embedded product brief specifies 3.20 GHz with one or two active cores and 2.80 GHz with four; actual behaviour depends on workload, cooling and platform limits. | 3.2 GHz base and up to 3.46 GHz Turbo Boost. Intel lists Q4 2009. The October on-sale month uses Tom's Hardware Italia's 20 October 2009 availability report and TweakTown's 21 October report of a listed OEM chip. Japan's boxed retail availability followed in February 2010. |
| Cache | – | 8 MB shared L3 cache. |
| Graphics and AI | ||
| Built-in graphics | No | No |
| Graphics | No processor graphics; Intel's desktop comparison chart lists graphics as not applicable. A separate graphics solution is required. | Intel's exact-model comparison chart lists no processor graphics. |
| Platform | ||
| Socket | LGA1156 | LGA1366 |
| Base power | 95 W | 130 W |
| Unlocked | No | No |
| Cooler in the box | – | Yes |
| Memory support | Two channels of DDR3-1066/1333. Optional maximum memory capacity and bandwidth are omitted because the retired exact-model specification page could not be read. | Three channels of DDR3-800 or DDR3-1066; up to 24 GB in Intel's 45 nm Core i7-900 datasheet. Faster memory used by reviews is not the maker's rated limit. |
| PCIe | 16 processor PCIe 2.0 lanes, configurable as one ×16 or two ×8 graphics links. A separate DMI link connects the processor to the chipset. | – |
| Process | 45 nm; Lynnfield, based on the Nehalem architecture. | 45 nm; Bloomfield. |
| Cooler | LGA1156 platform, distinct from LGA775 and LGA1366. Intel's 8 September 2009 notice names the 750 and says the new processors and P55 chipset are available that day. Cooler inclusion and package temperature are omitted where maker evidence is unavailable. | Intel's boxed-processor datasheet includes an unattached fan and heatsink. An LGA1366 motherboard is required. |
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