Intel Core i7-10700K vs Intel Core i7-9700K
Better figure, where one is clearly better
| IntelCore i7-10700K | IntelCore i7-9700K | |
|---|---|---|
| Overview | ||
| Released | May 2020 | October 2018 |
| Cores and clocks | ||
| Cores | 8 | 8 |
| Threads | 16 (better) | 8 |
| Base clock | 3.8 GHz | 3.6 GHz |
| Boost clock | 5.1 GHz (better) | 4.9 GHz |
| L3 cache | 16 MB (better) | 12 MB |
| Cores | Hyper-Threading supported; Intel Turbo Boost Max 3.0 targets favoured cores. Thermal Velocity Boost is not supported. | Eight cores without Hyper-Threading; Intel Turbo Boost 2.0 supported. |
| Clocks | Up to 5.1 GHz with Turbo Boost Max 3.0, or 5 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3.5 GHz base clock. Tom's Hardware reports 229 W PL2; the current Intel specification page publishes TDP only. | Maximum turbo is a single-core frequency; sustained clocks depend on cooling and motherboard power settings. Intel's current specification page publishes TDP without a separate maximum turbo-power figure. |
| Graphics and AI | ||
| Built-in graphics | Yes | Yes |
| Graphics | Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 30 Hz; DisplayPort up to 4096×2304 at 60 Hz; Quick Sync Video supported. | Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; three displays; Quick Sync Video. HDMI up to 4096×2304 at 24 Hz; DisplayPort and eDP up to 4096×2304 at 60 Hz. |
| Platform | ||
| Socket | LGA1200 | LGA1151 |
| Base power | 125 W | 95 W |
| Unlocked | Yes | Yes |
| Cooler in the box | No | No |
| Memory support | Up to 128 GB; two channels; DDR4-2933; 45.8 GB/s maximum bandwidth; ECC not supported. | Up to 128 GB; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported. |
| PCIe | PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4. | PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4. Intel's launch figure of 40 platform lanes includes chipset lanes. |
| Process | 14 nm; Comet Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Tom's Hardware identifies the ten-core die with two cores disabled and a soldered thermal interface. | 14 nm; Coffee Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel confirms a soldered thermal interface for the unlocked ninth-generation launch models. |
| Cooler | No cooler included with the boxed processor (Tom's Hardware exact-model review); an LGA1200-compatible thermal solution is required. | Boxed processor includes no fan or heatsink. Intel 300-series motherboard compatibility requires the appropriate BIOS and vendor support. |
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