Intel Core i5-14500 vs Intel Core i7-9700K

Every spec side by side, from each maker's published figures.

Better figure, where one is clearly better

Core i5-14500 compared with Core i7-9700K
IntelCore i5-14500IntelCore i7-9700K
Overview
ReleasedJanuary 2024October 2018
Cores and clocks
Cores14 (6 performance, 8 efficiency) (better)8
Threads20 (better)8
Base clock2.6 GHz3.6 GHz
Boost clock5 GHz (better)4.9 GHz
L3 cache24 MB (better)12 MB
Cores6 P-cores and 8 E-cores; 20 threads. ComputerBase identifies its tested sample as C0 Alder Lake silicon within the marketed Raptor Lake Refresh generation.Eight cores without Hyper-Threading; Intel Turbo Boost 2.0 supported.
ClocksP-cores: 2.6 GHz base, up to 5.0 GHz turbo. E-cores: 1.9 GHz base, up to 3.7 GHz turbo.Maximum turbo is a single-core frequency; sustained clocks depend on cooling and motherboard power settings. Intel's current specification page publishes TDP without a separate maximum turbo-power figure.
Cache24 MB Intel Smart Cache (L3); 11.5 MB total L2.–
Graphics and AI
Built-in graphicsYesYes
GraphicsIntel UHD Graphics 770; 32 execution units; up to 1.55 GHz; Quick Sync Video; up to four displays.Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; three displays; Quick Sync Video. HDMI up to 4096×2304 at 24 Hz; DisplayPort and eDP up to 4096×2304 at 60 Hz.
Platform
SocketLGA1700LGA1151
Base power65 W95 W
Maximum power154 W–
UnlockedNoYes
Cooler in the boxYesNo
Memory supportUp to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s; ECC supported with an appropriate platform.Up to 128 GB; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported.
PCIePCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4. Intel's launch figure of 40 platform lanes includes chipset lanes.
ChipsetsIntel 600- and 700-series motherboards; appropriate BIOS support required.–
ProcessIntel 7; Raptor Lake Refresh generation. ComputerBase identifies the tested sample as C0 Alder Lake silicon. 45 × 37.5 mm package; 100°C maximum junction temperature.14 nm; Coffee Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel confirms a soldered thermal interface for the unlocked ninth-generation launch models.
CoolerIntel Laminar RM1 included with the boxed processor (Intel support).Boxed processor includes no fan or heatsink. Intel 300-series motherboard compatibility requires the appropriate BIOS and vendor support.

More comparisons