Intel Core i7-5820K vs Intel Core i7-5960X
Better figure, where one is clearly better
| IntelCore i7-5820K | IntelCore i7-5960X | |
|---|---|---|
| Overview | ||
| Released | August 2014 | August 2014 |
| Cores and clocks | ||
| Cores | 6 | 8 (better) |
| Threads | 12 | 16 (better) |
| Base clock | 3.3 GHz | 3 GHz |
| Boost clock | 3.6 GHz (better) | 3.5 GHz |
| L3 cache | 15 MB | 20 MB (better) |
| Cores | Haswell-E; six cores with Hyper-Threading; unlocked multiplier and lack of integrated graphics confirmed by exact-model reviews | Haswell-E; 8 cores with Hyper-Threading. The unlocked multiplier is confirmed by the exact-model reviews. |
| Clocks | – | Turbo Boost 2.0 up to 3.50 GHz. August release month follows PCWorld’s 29 August report that Intel was shipping the models and TechSpot’s same-day expected retail availability. Intel’s 29 August notice instead says the three SKUs will be available next week; an exact maker first-sale day is unresolved. |
| Graphics and AI | ||
| Built-in graphics | No | No |
| Graphics | – | No processor graphics, confirmed by Intel’s exact-model comparison-chart row; a separate graphics solution is required. |
| Platform | ||
| Socket | LGA2011-v3 | LGA2011-v3 |
| Base power | 140 W | 140 W |
| Unlocked | Yes | Yes |
| Cooler in the box | No | No |
| Memory support | Up to 64 GB; four channels; DDR4-1600/1866/2133; maximum bandwidth 68 GB/s; no ECC support | Up to 64 GB; four channels of DDR4-1600/1866/2133; maximum bandwidth 68 GB/s; no ECC. |
| PCIe | 28 CPU lanes; PCIe 3.0 | 40 CPU lanes; PCIe 3.0 |
| Chipsets | X99 and LGA2011-v3, as distinguished by Intel's Core i7 comparison chart and exact-model reviews. August release month follows Intel's 29 August family availability notice and contemporary exact-model stock coverage; an exact maker-SKU first-sale day was not established. | X99 and LGA2011-v3, distinguished by Intel’s exact-model comparison chart and the reviews. Current ARK abbreviates the socket as FCLGA2011; this is not compatible with the older X79 LGA2011 platform. |
| Process | 22 nm; package size 52.5 × 45 mm | 22 nm; Haswell-E. Package size 52.5 × 45.0 mm. |
| Cooler | Intel explicitly excludes a fan and heatsink from the boxed product; a separate cooler is required | Intel explicitly excludes a fan and heatsink from the boxed product; a separate compatible cooler is required. |
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