Intel Core i7-7700K vs Intel Core i7-7740X

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Core i7-7700K compared with Core i7-7740X

	IntelCore i7-7700K	IntelCore i7-7740X
Overview
Released
Released	January 2017	June 2017
Cores and clocks
Cores
Cores	4	4
Threads
Threads	8	8
Base clock
Base clock	4.2 GHz	4.3 GHz
Boost clock
Boost clock	4.5 GHz	4.5 GHz
L3 cache
L3 cache	8 MB	8 MB
Cores
Cores	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported.	Kaby Lake-X with Hyper-Threading; unlocked core multiplier confirmed by KitGuru’s exact-model technical table and overclocking test.
Clocks
Clocks	Maximum turbo is a single-core frequency; overclocking requires an appropriate motherboard and cooling. Intel publishes TDP without a separate maximum turbo-power figure.	Turbo Boost 2.0 up to 4.50 GHz; no Turbo Boost Max 3.0 in Intel’s exact comparison-chart row. Intel’s press-kit record names 26 June 2017 availability for the first Core X processors, and its August record confirms the four- to ten-core models were already on shelves; conservative month precision is retained.
Cache
Cache	–	8 MB cache; L3 designation confirmed by KitGuru’s exact-model table.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	No
Graphics
Graphics	Intel HD Graphics 630; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. Hardware HEVC 10-bit encode and decode, and VP9 10-bit decode, according to Intel's desktop product brief.	No processor graphics, explicitly confirmed by Intel’s exact-model comparison chart.
Platform
Socket
Socket	LGA1151	LGA2066
Base power
Base power	91 W	112 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	Up to 64 GB; two channels; DDR4-2133/2400 or DDR3L-1333/1600 at 1.35 V; ECC not supported.	Up to 64 GB; two channels of DDR4-2666; 42 GB/s maximum published bandwidth; no ECC.
PCIe
PCIe	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.	16 CPU PCIe lanes; up to 1×16, 2×8 or 1×8 plus 2×4.
Chipsets
Chipsets	–	Intel X299; LGA2066.
Process
Process	14 nm; Kaby Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel describes the manufacturing process as 14 nm+ in its product brief.	14 nm; Kaby Lake-X.
Cooler
Cooler	Boxed processor includes no fan or heatsink. Intel announced the desktop family on 3 January 2017; TechSpot's contemporaneous launch review confirms availability that day.	Intel excludes a fan and heatsink from the boxed product; junction limit 100°C.