Intel Core i9-10900K vs Intel Core i9-9900K

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Core i9-10900K compared with Core i9-9900K

	IntelCore i9-10900K	IntelCore i9-9900K
Overview
Released
Released	May 2020	October 2018
Cores and clocks
Cores
Cores	10 (better)	8
Threads
Threads	20 (better)	16
Base clock
Base clock	3.7 GHz	3.6 GHz
Boost clock
Boost clock	5.3 GHz (better)	5 GHz
L3 cache
L3 cache	20 MB (better)	16 MB
Cores
Cores	Hyper-Threading, Turbo Boost Max 3.0 and Thermal Velocity Boost supported.	8 cores and 16 threads; Coffee Lake architecture; multiplier unlocked. Intel’s 19 October 2018 public news notice states that the processors ship that day; the 8 October announcement opened preorders.
Clocks
Clocks	Up to 5.3 GHz with Thermal Velocity Boost at its 70°C temperature threshold; up to 5.2 GHz with Turbo Boost Max 3.0, or 5.1 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3.3 GHz base clock. Tom's Hardware reports 250 W during boost; the current Intel specification page publishes TDP only.	3.6 GHz base; up to 5.0 GHz Intel Turbo Boost 2.0.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 30 Hz; DisplayPort up to 4096×2304 at 60 Hz; Quick Sync Video supported.	Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; Quick Sync Video; up to three displays.
Platform
Socket
Socket	LGA1200	LGA1151
Base power
Base power	125 W	95 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	Up to 128 GB; two channels; DDR4-2933; 45.8 GB/s maximum bandwidth; ECC not supported.	Up to 128 GB on the current Intel specification page; two channels; DDR4-2666; 41.6 GB/s; ECC not supported.
PCIe
PCIe	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.	PCIe 3.0; 16 CPU lanes: 1 × 16, 2 × 8 or 1 × 8 + 2 × 4. This excludes chipset lanes.
Chipsets
Chipsets	–	Intel 300-series motherboards, with appropriate BIOS support; Z390 was introduced alongside this generation.
Process
Process	14 nm; Comet Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature.	14 nm; 37.5 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	No cooler included with the boxed processor (Tom's Hardware exact-model review); an LGA1200-compatible thermal solution is required.	No fan or heatsink included with the boxed processor (Intel specifications).