Intel Core i5-14500 vs Intel Core i9-10900K

Every spec side by side, from each maker's published figures.

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Core i5-14500 compared with Core i9-10900K
IntelCore i5-14500IntelCore i9-10900K
Overview
ReleasedJanuary 2024May 2020
Cores and clocks
Cores14 (6 performance, 8 efficiency) (better)10
Threads2020
Base clock2.6 GHz3.7 GHz
Boost clock5 GHz5.3 GHz (better)
L3 cache24 MB (better)20 MB
Cores6 P-cores and 8 E-cores; 20 threads. ComputerBase identifies its tested sample as C0 Alder Lake silicon within the marketed Raptor Lake Refresh generation.Hyper-Threading, Turbo Boost Max 3.0 and Thermal Velocity Boost supported.
ClocksP-cores: 2.6 GHz base, up to 5.0 GHz turbo. E-cores: 1.9 GHz base, up to 3.7 GHz turbo.Up to 5.3 GHz with Thermal Velocity Boost at its 70°C temperature threshold; up to 5.2 GHz with Turbo Boost Max 3.0, or 5.1 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3.3 GHz base clock. Tom's Hardware reports 250 W during boost; the current Intel specification page publishes TDP only.
Cache24 MB Intel Smart Cache (L3); 11.5 MB total L2.–
Graphics and AI
Built-in graphicsYesYes
GraphicsIntel UHD Graphics 770; 32 execution units; up to 1.55 GHz; Quick Sync Video; up to four displays.Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 30 Hz; DisplayPort up to 4096×2304 at 60 Hz; Quick Sync Video supported.
Platform
SocketLGA1700LGA1200
Base power65 W125 W
Maximum power154 W–
UnlockedNoYes
Cooler in the boxYesNo
Memory supportUp to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s; ECC supported with an appropriate platform.Up to 128 GB; two channels; DDR4-2933; 45.8 GB/s maximum bandwidth; ECC not supported.
PCIePCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.
ChipsetsIntel 600- and 700-series motherboards; appropriate BIOS support required.–
ProcessIntel 7; Raptor Lake Refresh generation. ComputerBase identifies the tested sample as C0 Alder Lake silicon. 45 × 37.5 mm package; 100°C maximum junction temperature.14 nm; Comet Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature.
CoolerIntel Laminar RM1 included with the boxed processor (Intel support).No cooler included with the boxed processor (Tom's Hardware exact-model review); an LGA1200-compatible thermal solution is required.

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