AMD Ryzen 5 8500G vs AMD Ryzen 7 8700G

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Ryzen 5 8500G compared with Ryzen 7 8700G

	AMDRyzen 5 8500G	AMDRyzen 7 8700G
Overview
Released
Released	January 2024	January 2024
Cores and clocks
Cores
Cores	6	8 (better)
Threads
Threads	12	16 (better)
Base clock
Base clock	3.5 GHz	4.2 GHz
Boost clock
Boost clock	5 GHz	5.1 GHz (better)
L3 cache
L3 cache	16 MB	16 MB
Cores
Cores	Two Zen 4 and four Zen 4c cores; both support simultaneous multithreading. AMD names the family Phoenix; TechPowerUp identifies the smaller monolithic Phoenix 2 die.	Zen 4; Phoenix; simultaneous multithreading; one monolithic package die.
Clocks
Clocks	AMD lists 3.5 GHz overall base; Zen 4 base 4.1 GHz, boost up to 5 GHz; Zen 4c base 3.3 GHz, boost up to 3.7 GHz. CPU multiplier locked in TechPowerUp testing; Precision Boost Overdrive, Curve Optimizer and EXPO supported. Configurable TDP 45–65 W.	Precision Boost 2; Precision Boost Overdrive and Curve Optimizer supported; configurable TDP 45–65 W.
Cache
Cache	6 MB L2; 16 MB shared L3.	8 MB L2; 16 MB L3.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Radeon 740M; RDNA 3; four graphics cores at 2800 MHz; up to four displays; DisplayPort 2.1 and HDMI 2.1; hardware AV1 encode and decode.	Radeon 780M; RDNA 3; 12 graphics cores at 2900 MHz; up to four displays; DisplayPort 2.1 and HDMI 2.1; hardware AV1 encode and decode.
AI engine
AI engine	No dedicated Ryzen AI NPU (TechPowerUp and Phoronix).	AMD Ryzen AI; XDNA neural processing unit; up to 16 TOPS.
Platform
Socket
Socket	AM5	AM5
Base power
Base power	65 W	65 W
Unlocked
Unlocked	No	Yes
Memory support
Memory support	DDR5 UDIMM; two channels; AMD lists maximum DDR5 capacity of 96 GB; ECC requires platform support. Two single- or dual-rank DIMMs: DDR5-5200; four single- or dual-rank DIMMs: DDR5-3600.	DDR5 UDIMM; two channels; up to 256 GB on the current AMD specification page; ECC requires platform support. Two single- or dual-rank DIMMs: DDR5-5200; four single- or dual-rank DIMMs: DDR5-3600.
PCIe
PCIe	PCIe 4.0; 14 native lanes, 10 usable; graphics slot limited to ×4 (TechPowerUp). Two native USB4 40 Gbps, two USB 3.2 Gen 2 10 Gbps and one USB 2.0 port.	PCIe 4.0; 20 native lanes, 16 usable; discrete graphics slot up to ×8 (PC Gamer and TechSpot). Two native USB4 40 Gbps, two USB 3.2 Gen 2 10 Gbps and one USB 2.0 port.
Chipsets
Chipsets	AMD lists A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850; motherboard firmware support required.	AMD lists A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850; motherboard firmware support required.
Process
Process	TSMC 4nm FinFET; 137 mm² CPU compute die; one package die.	TSMC 4nm FinFET; 178 mm² CPU compute die.
Cooler
Cooler	95°C maximum operating temperature. Retail review package includes an air cooler (TechPowerUp); check the exact retail or tray bundle.	95°C maximum operating temperature. Launch review boxes included a Wraith Spire (PC Gamer); current AMD IDs include SBX and CSX, and the maker notes revised cooler bundles for selected MPK models from August 2025. Verify the exact retail bundle.