AMD Ryzen 7 5800X3D vs Intel Core i9-11900K

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Ryzen 7 5800X3D compared with Core i9-11900K

	AMDRyzen 7 5800X3D	IntelCore i9-11900K
Overview
Released
Released	April 2022	March 2021
Cores and clocks
Cores
Cores	8	8
Threads
Threads	16	16
Base clock
Base clock	3.4 GHz	3.5 GHz
Boost clock
Boost clock	4.5 GHz	5.3 GHz (better)
L3 cache
L3 cache	96 MB (better)	16 MB
Cores
Cores	8 Zen 3 cores with simultaneous multithreading; codename Vermeer; 2 dies in the package	Hyper-Threading, Turbo Boost Max 3.0, Thermal Velocity Boost, AVX-512 and Deep Learning Boost supported. General retail sale began 30 March 2021, according to Intel's sales-embargo statement reported by Windows Central; the 16 March maker press release was the announcement.
Clocks
Clocks	–	Up to 5.3 GHz with Thermal Velocity Boost at its 70°C temperature threshold; up to 5.2 GHz with Turbo Boost Max 3.0, or 5.1 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3 GHz base clock. Adaptive Boost Technology raises all-core clocks when power and thermal conditions allow (PC Gamer). Tom's Hardware reports 250 W PL2; the current Intel specification page publishes TDP only.
Cache
Cache	L1 512 KB, L2 4 MB, L3 96 MB	–
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	None; a graphics card is required	Intel UHD Graphics 750; 32 execution units; 350 MHz base, up to 1.3 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 60 Hz; DisplayPort up to 5120×3200 at 60 Hz; Quick Sync Video supported.
AI engine
AI engine	–	Intel Gaussian & Neural Accelerator 2.0; Deep Learning Boost on the CPU.
Platform
Socket
Socket	AM4	LGA1200
Base power
Base power	105 W	125 W
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR4, 2 channels, up to 128 GB (UDIMM); DDR4-3200 with 2 modules, DDR4-2933 (1 rank), DDR4-2667 (2 rank) with 4; ECC with motherboard support	Up to 128 GB; two channels; DDR4-3200; 50 GB/s maximum bandwidth; ECC not supported. Tom's Hardware identifies DDR4-3200 Gear 1 as officially supported on the Core i9 models.
PCIe
PCIe	PCIe 4.0; 24 lanes (20 usable); native USB: 4 × USB 3.2 Gen 2 (10Gbps)	PCIe 4.0; 20 CPU lanes, configured as 1×16+1×4, 2×8+1×4 or 1×8+3×4.
Chipsets
Chipsets	X570, X470, B550, B450, A520	–
Process
Process	TSMC 7nm FinFET (CPU cores), 12nm (Globalfoundries) (I/O die)	14 nm; Rocket Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Cypress Cove CPU architecture (Intel launch announcement).
Cooler
Cooler	Not included; Liquid cooler recommended for optimal performance; Tjmax 90°C	No cooler included with the boxed processor (Tom's Hardware exact-model review).