AMD Ryzen 9 7900X3D vs Intel Core i5-13600K

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Ryzen 9 7900X3D compared with Core i5-13600K

	AMDRyzen 9 7900X3D	IntelCore i5-13600K
Overview
Released
Released	February 2023	October 2022
Cores and clocks
Cores
Cores	12	14 (6 performance, 8 efficiency) (better)
Threads
Threads	24 (better)	20
Base clock
Base clock	4.4 GHz	3.5 GHz
Boost clock
Boost clock	5.6 GHz (better)	5.1 GHz
L3 cache
L3 cache	128 MB (better)	24 MB
Cores
Cores	Zen 4; Raphael; 3 package dies; simultaneous multithreading; two compute chiplets with 6 active cores each, one with 3D V-Cache (Tom's Hardware)	6 P-cores and 8 E-cores; 20 threads. Intel Thread Director supported.
Clocks
Clocks	Direct CPU frequency overclocking is disabled; Precision Boost Overdrive, Curve Optimizer and memory tuning are supported (Tom's Hardware). AMD product launch date 28 February 2023 is corroborated as retail release by TechRadar	P-cores: 3.5 GHz base, up to 5.1 GHz turbo. E-cores: 2.6 GHz base, up to 3.9 GHz turbo.
Cache
Cache	L1 768 KB; L2 12 MB; L3 128 MB; 96 MB L3 on the cache chiplet and 32 MB on the other (Tom's Hardware)	24 MB Intel Smart Cache (L3); 20 MB total L2.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	AMD Radeon Graphics; 2 graphics cores at 2200 MHz; USB-C DisplayPort Alternate Mode supported	Intel UHD Graphics 770; 32 execution units; 300 MHz base, up to 1.5 GHz; Quick Sync Video; up to four displays.
Platform
Socket
Socket	AM5	LGA1700
Base power
Base power	120 W	125 W
Maximum power
Maximum power	–	181 W
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	DDR5 UDIMM; 2 memory channels; maximum 128 GB; ECC requires motherboard support. 2 single- or dual-rank DIMMs: DDR5-5200; 4 single- or dual-rank DIMMs: DDR5-3600; AMD EXPO memory overclocking supported	Up to 192 GB on the current Intel specification page; two channels; DDR5-5600 or DDR4-3200; 89.6 GB/s; ECC supported with an appropriate platform.
PCIe
PCIe	PCIe 5.0; 28 native lanes, 24 usable; 4 native USB 3.2 Gen 2 ports, 1 USB 2.0 port; no native SATA ports	PCIe 5.0 and 4.0; 20 CPU lanes: 1×16+4 or 2×8+4; DMI 4.0 ×8.
Chipsets
Chipsets	A620, X670E, X670, B650E, B650, X870E, X870, B840 and B850	Intel 600- and 700-series motherboards; BIOS support required. Intel recommends the latest motherboard BIOS and Intel Default Settings to mitigate 13th/14th-generation Vmin Shift instability risk; 0x12F supplements earlier mitigations (Intel, May 2025).
Process
Process	TSMC 5nm FinFET CPU cores; TSMC 6nm FinFET I/O die; CPU compute die 71 mm², I/O die 122 mm²	Intel 7; Raptor Lake; 45×37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	Not included; Tjmax 89°C; AMD recommends liquid cooling for optimal performance	Boxed K processor does not include a fan heatsink (Intel support).