Intel Core 2 Duo E6600 vs Intel Core i9-13900KS
Better figure, where one is clearly better
| IntelCore 2 Duo E6600 | IntelCore i9-13900KS | |
|---|---|---|
| Overview | ||
| Released | July 2006 | January 2023 |
| Cores and clocks | ||
| Cores | 2 | 24 (8 performance, 16 efficiency) (better) |
| Threads | 2 | 32 (better) |
| Base clock | 2.4 GHz | 3.2 GHz |
| Boost clock | – | 6 GHz |
| L3 cache | – | 36 MB |
| Cores | Conroe; two cores and two threads, without Hyper-Threading. | Raptor Lake; 8 Performance-cores with Hyper-Threading and 16 Efficient-cores |
| Clocks | Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel unveiled the family on 27 July 2006 and said complete Core 2 Duo desktop systems would arrive in early August. TechSpot’s 2 August review says boxed CPUs began shipping late the previous week, supporting July CPU availability without an exact sale day. No unpublished boost figure is supplied. | P-core base 3.2 GHz and turbo 5.4 GHz; E-core base 2.4 GHz and turbo 4.3 GHz; Turbo Boost Max 3.0 5.8 GHz; Thermal Velocity Boost up to 6 GHz |
| Cache | 4 MB shared L2 cache, as Intel’s datasheet states; no L3 figure supplied. | 32 MB L2 cache |
| Graphics and AI | ||
| Built-in graphics | No | Yes |
| Graphics | No integrated graphics, explicitly confirmed by the exact-model CPU-Monkey specification entry. Chipset graphics are separate from the processor. | Intel UHD Graphics 770; 32 execution units; 300 MHz base and 1.65 GHz maximum dynamic clock |
| Platform | ||
| Socket | LGA775 | LGA1700 |
| Base power | 65 W | 150 W |
| Maximum power | – | 253 W |
| Unlocked | – | Yes |
| Cooler in the box | Yes | – |
| Memory support | Intel’s datasheet routes memory and I/O transactions through the front-side bus and chipset; memory types and capacity depend on the motherboard. | Up to 192 GB; two channels; DDR5-5600 or DDR4-3200; ECC support depends on the motherboard and configuration |
| PCIe | – | 20 CPU lanes; PCIe 5.0 and 4.0 |
| Chipsets | – | Intel recommends Z790 or Z690 with the latest BIOS |
| Process | 65 nm; Conroe; LGA775. | Intel 7 |
| Cooler | Intel’s boxed-processor specification confirms an unattached fan heatsink. Published processor TDP is 65 W. | Maximum operating temperature 100 °C; maker maximum turbo power 253 W. The 320 W Extreme profiles used in launch reviews are separate operating configurations. |
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