Intel Core 2 Duo E8400 vs Intel Core i7-7700K

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Core 2 Duo E8400 compared with Core i7-7700K

	IntelCore 2 Duo E8400	IntelCore i7-7700K
Overview
Released
Released	January 2008	January 2017
Cores and clocks
Cores
Cores	2	4 (better)
Threads
Threads	2	8 (better)
Base clock
Base clock	3 GHz	4.2 GHz
Boost clock
Boost clock	–	4.5 GHz
L3 cache
L3 cache	–	8 MB
Cores
Cores	Wolfdale; two cores and two threads, without Hyper-Threading. Intel’s archived exact E8400 specifications are attached to the maker datasheet distributed by Mouser.	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported.
Clocks
Clocks	Published operating frequency 3.00 GHz; 1333 MHz front-side bus. Intel explicitly lists no Turbo Boost, so no boost figure is supplied. Intel’s CES fact sheet specifies January 2008 availability for this exact model; TechSpot’s 1 February review confirms retail stock, with early shortages and prices above target. An exact first-sale day remains unverified.	Maximum turbo is a single-core frequency; overclocking requires an appropriate motherboard and cooling. Intel publishes TDP without a separate maximum turbo-power figure.
Cache
Cache	6 MB shared L2 cache; no L3 figure supplied.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics, explicitly confirmed by the exact BX80570E8400 Newegg listing; motherboard graphics are separate.	Intel HD Graphics 630; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. Hardware HEVC 10-bit encode and decode, and VP9 10-bit decode, according to Intel's desktop product brief.
Platform
Socket
Socket	LGA775	LGA1151
Base power
Base power	65 W	91 W
Unlocked
Unlocked	–	Yes
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	Memory and I/O transactions pass through the front-side bus and chipset, as Intel’s datasheet states; supported memory types and capacity depend on the motherboard.	Up to 64 GB; two channels; DDR4-2133/2400 or DDR3L-1333/1600 at 1.35 V; ECC not supported.
PCIe
PCIe	–	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.
Process
Process	45 nm; Wolfdale; LGA775; SSE4.1 support.	14 nm; Kaby Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel describes the manufacturing process as 14 nm+ in its product brief.
Cooler
Cooler	Intel’s boxed-processor specification confirms a supplied cooling solution; exact BX80570E8400 listing confirms heatsink and fan. Published processor TDP is 65 W.	Boxed processor includes no fan or heatsink. Intel announced the desktop family on 3 January 2017; TechSpot's contemporaneous launch review confirms availability that day.