Intel Core i3-13100F vs Intel Core i9-10900K

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Core i3-13100F compared with Core i9-10900K

	IntelCore i3-13100F	IntelCore i9-10900K
Overview
Released
Released	January 2023	May 2020
Cores and clocks
Cores
Cores	4 (4 performance, 0 efficiency)	10 (better)
Threads
Threads	8	20 (better)
Base clock
Base clock	3.4 GHz	3.7 GHz
Boost clock
Boost clock	4.5 GHz	5.3 GHz (better)
L3 cache
L3 cache	12 MB	20 MB (better)
Cores
Cores	Four P-cores and no E-cores; Hyper-Threading supported.	Hyper-Threading, Turbo Boost Max 3.0 and Thermal Velocity Boost supported.
Clocks
Clocks	CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.	Up to 5.3 GHz with Thermal Velocity Boost at its 70°C temperature threshold; up to 5.2 GHz with Turbo Boost Max 3.0, or 5.1 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3.3 GHz base clock. Tom's Hardware reports 250 W during boost; the current Intel specification page publishes TDP only.
Cache
Cache	12 MB Intel Smart Cache (L3); 5 MB total L2.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 30 Hz; DisplayPort up to 4096×2304 at 60 Hz; Quick Sync Video supported.
AI engine
AI engine	Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.	–
Platform
Socket
Socket	LGA1700	LGA1200
Base power
Base power	58 W	125 W
Maximum power
Maximum power	110 W	–
Unlocked
Unlocked	No	Yes
Cooler in the box
Cooler in the box	Yes	No
Memory support
Memory support	Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.	Up to 128 GB; two channels; DDR4-2933; 45.8 GB/s maximum bandwidth; ECC not supported.
PCIe
PCIe	PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.
Process
Process	Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.	14 nm; Comet Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	Boxed retail processor includes Intel Laminar RM1 (Intel support).	No cooler included with the boxed processor (Tom's Hardware exact-model review); an LGA1200-compatible thermal solution is required.