Intel Core i5-10400F vs Intel Core i5-10600K

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Core i5-10400F compared with Core i5-10600K
IntelCore i5-10400FIntelCore i5-10600K
Overview
ReleasedMay 2020May 2020
Cores and clocks
Cores66
Threads1212
Base clock2.9 GHz4.1 GHz
Boost clock4.3 GHz4.8 GHz (better)
L3 cache12 MB12 MB
CoresHyper-Threading supported; Intel Turbo Boost 2.0 supported, without Turbo Boost Max 3.0 or Thermal Velocity Boost.Hyper-Threading and Intel Turbo Boost 2.0 supported; no Turbo Boost Max 3.0 or Thermal Velocity Boost.
ClocksLocked CPU multiplier (Intel support). ComputerBase reports an Intel-confirmed 134 W PL2 limit for 28 seconds; the current Intel specification page publishes TDP only.Configurable TDP-down to 95 W with a 3.8 GHz base clock. CPU multiplier unlocked (Intel support).
Graphics and AI
Built-in graphicsNoYes
GraphicsNo integrated graphics; a separate graphics card is required (Intel support).Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 30 Hz; DisplayPort up to 4096×2304 at 60 Hz; Quick Sync Video supported.
Platform
SocketLGA1200LGA1200
Base power65 W125 W
UnlockedNoYes
Cooler in the box–No
Memory supportUp to 128 GB; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported.Up to 128 GB; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported.
PCIePCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.
Process14 nm; Comet Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. ComputerBase identifies G1 six-core-die and Q0 ten-core-die versions with the same published core, cache and clock specifications; its G1 sample uses thermal paste under the heat spreader, while Q0 is soldered.14 nm; Comet Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. PC Gamer identifies the ten-core die with four cores disabled and a soldered thermal interface.
Cooler–No cooler included in the boxed processor (bit-tech exact-model specification and packaging description); an LGA1200-compatible thermal solution is required.

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