Intel Core i5-10400F vs Intel Core i5-11400F

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Core i5-10400F compared with Core i5-11400F

	IntelCore i5-10400F	IntelCore i5-11400F
Overview
Released
Released	May 2020	March 2021
Cores and clocks
Cores
Cores	6	6
Threads
Threads	12	12
Base clock
Base clock	2.9 GHz	2.6 GHz
Boost clock
Boost clock	4.3 GHz	4.4 GHz (better)
L3 cache
L3 cache	12 MB	12 MB
Cores
Cores	Hyper-Threading supported; Intel Turbo Boost 2.0 supported, without Turbo Boost Max 3.0 or Thermal Velocity Boost.	6 cores and 12 threads; Rocket Lake, Cypress Cove architecture. Multiplier locked (Rock Paper Shotgun). First sale on 30 March 2021 is reported by TechRadar from Intel’s statement; the 16 March press release announced the generation.
Clocks
Clocks	Locked CPU multiplier (Intel support). ComputerBase reports an Intel-confirmed 134 W PL2 limit for 28 seconds; the current Intel specification page publishes TDP only.	2.6 GHz base; up to 4.4 GHz Intel Turbo Boost 2.0.
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics; a separate graphics card is required (Intel support).	No integrated graphics; a separate graphics card is required (Intel F-series support).
Platform
Socket
Socket	LGA1200	LGA1200
Base power
Base power	65 W	65 W
Unlocked
Unlocked	No	No
Cooler in the box
Cooler in the box	–	Yes
Memory support
Memory support	Up to 128 GB; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported.	Up to 128 GB; two channels; DDR4-3200; 50 GB/s stated by Intel; ECC not supported.
PCIe
PCIe	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.	PCIe 4.0; 20 CPU lanes: 1×16+1×4, 2×8+1×4 or 1×8+3×4.
Chipsets
Chipsets	–	500-series and selected Z490/H470 motherboards with appropriate BIOS support (Rock Paper Shotgun); support is not universal across all 400-series boards.
Process
Process	14 nm; Comet Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. ComputerBase identifies G1 six-core-die and Q0 ten-core-die versions with the same published core, cache and clock specifications; its G1 sample uses thermal paste under the heat spreader, while Q0 is soldered.	14 nm; 37.5×37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	–	A fan heatsink is included with the retail box (TechPowerUp exact-model unboxing).