Intel Core i5-9600K vs Intel Core i7-9700K
Better figure, where one is clearly better
| IntelCore i5-9600K | IntelCore i7-9700K | |
|---|---|---|
| Overview | ||
| Released | October 2018 | October 2018 |
| Cores and clocks | ||
| Cores | 6 | 8 (better) |
| Threads | 6 | 8 (better) |
| Base clock | 3.7 GHz | 3.6 GHz |
| Boost clock | 4.6 GHz | 4.9 GHz (better) |
| L3 cache | 9 MB | 12 MB (better) |
| Cores | Six cores without Hyper-Threading; Intel Turbo Boost 2.0 supported. | Eight cores without Hyper-Threading; Intel Turbo Boost 2.0 supported. |
| Clocks | Maximum turbo is a single-core frequency; sustained clocks depend on cooling and motherboard power settings. Intel publishes TDP without a separate maximum turbo-power figure. TechSpot's 2023 revisit uses newer games; Notebookcheck's preselected and delidded sample results are separate from its ordinary retail sample. | Maximum turbo is a single-core frequency; sustained clocks depend on cooling and motherboard power settings. Intel's current specification page publishes TDP without a separate maximum turbo-power figure. |
| Graphics and AI | ||
| Built-in graphics | Yes | Yes |
| Graphics | Intel UHD Graphics 630; 350 MHz base, up to 1.15 GHz; three displays; Quick Sync Video. HDMI up to 4096×2304 at 24 Hz; DisplayPort and eDP up to 4096×2304 at 60 Hz. | Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; three displays; Quick Sync Video. HDMI up to 4096×2304 at 24 Hz; DisplayPort and eDP up to 4096×2304 at 60 Hz. |
| Platform | ||
| Socket | LGA1151 | LGA1151 |
| Base power | 95 W | 95 W |
| Unlocked | Yes | Yes |
| Cooler in the box | No | No |
| Memory support | Up to 128 GB; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported. | Up to 128 GB; two channels; DDR4-2666; 41.6 GB/s maximum bandwidth; ECC not supported. |
| PCIe | PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4. | PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4. Intel's launch figure of 40 platform lanes includes chipset lanes. |
| Process | 14 nm; Coffee Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel confirms a soldered thermal interface for the unlocked ninth-generation launch models. | 14 nm; Coffee Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Intel confirms a soldered thermal interface for the unlocked ninth-generation launch models. |
| Cooler | Boxed processor includes no fan or heatsink. Intel 300-series motherboard compatibility requires the appropriate BIOS and vendor support. | Boxed processor includes no fan or heatsink. Intel 300-series motherboard compatibility requires the appropriate BIOS and vendor support. |
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