Intel Core i7-10700K vs Intel Core i9-10900K

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Core i7-10700K compared with Core i9-10900K

	IntelCore i7-10700K	IntelCore i9-10900K
Overview
Released
Released	May 2020	May 2020
Cores and clocks
Cores
Cores	8	10 (better)
Threads
Threads	16	20 (better)
Base clock
Base clock	3.8 GHz	3.7 GHz
Boost clock
Boost clock	5.1 GHz	5.3 GHz (better)
L3 cache
L3 cache	16 MB	20 MB (better)
Cores
Cores	Hyper-Threading supported; Intel Turbo Boost Max 3.0 targets favoured cores. Thermal Velocity Boost is not supported.	Hyper-Threading, Turbo Boost Max 3.0 and Thermal Velocity Boost supported.
Clocks
Clocks	Up to 5.1 GHz with Turbo Boost Max 3.0, or 5 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3.5 GHz base clock. Tom's Hardware reports 229 W PL2; the current Intel specification page publishes TDP only.	Up to 5.3 GHz with Thermal Velocity Boost at its 70°C temperature threshold; up to 5.2 GHz with Turbo Boost Max 3.0, or 5.1 GHz with Turbo Boost 2.0. Configurable TDP-down to 95 W with a 3.3 GHz base clock. Tom's Hardware reports 250 W during boost; the current Intel specification page publishes TDP only.
Graphics and AI
Built-in graphics
Built-in graphics	Yes	Yes
Graphics
Graphics	Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 30 Hz; DisplayPort up to 4096×2304 at 60 Hz; Quick Sync Video supported.	Intel UHD Graphics 630; 350 MHz base, up to 1.2 GHz; up to 64 GB shared graphics memory; three displays. HDMI up to 4096×2160 at 30 Hz; DisplayPort up to 4096×2304 at 60 Hz; Quick Sync Video supported.
Platform
Socket
Socket	LGA1200	LGA1200
Base power
Base power	125 W	125 W
Unlocked
Unlocked	Yes	Yes
Cooler in the box
Cooler in the box	No	No
Memory support
Memory support	Up to 128 GB; two channels; DDR4-2933; 45.8 GB/s maximum bandwidth; ECC not supported.	Up to 128 GB; two channels; DDR4-2933; 45.8 GB/s maximum bandwidth; ECC not supported.
PCIe
PCIe	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.
Process
Process	14 nm; Comet Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature. Tom's Hardware identifies the ten-core die with two cores disabled and a soldered thermal interface.	14 nm; Comet Lake; 37.5 × 37.5 mm package; 100°C maximum junction temperature.
Cooler
Cooler	No cooler included with the boxed processor (Tom's Hardware exact-model review); an LGA1200-compatible thermal solution is required.	No cooler included with the boxed processor (Tom's Hardware exact-model review); an LGA1200-compatible thermal solution is required.