Intel Core 2 Duo E6600 vs Intel Core 2 Quad Q6600

Every spec side by side, from each maker's published figures.

Only show differences

Better figure, where one is clearly better

Share comparison

Core 2 Duo E6600 compared with Core 2 Quad Q6600

	IntelCore 2 Duo E6600	IntelCore 2 Quad Q6600
Overview
Released
Released	July 2006	January 2007
Cores and clocks
Cores
Cores	2	4 (better)
Threads
Threads	2	4 (better)
Base clock
Base clock	2.4 GHz	2.4 GHz
Cores
Cores	Conroe; two cores and two threads, without Hyper-Threading.	Kentsfield; four cores and four threads, without Hyper-Threading. Original B3 stepping is the numerical baseline; later G0 retains the model name and core/cache figures. Locked multiplier confirmed by bit-tech’s exact-model review.
Clocks
Clocks	Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel unveiled the family on 27 July 2006 and said complete Core 2 Duo desktop systems would arrive in early August. TechSpot’s 2 August review says boxed CPUs began shipping late the previous week, supporting July CPU availability without an exact sale day. No unpublished boost figure is supplied.	Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel’s 8 January 2007 release explicitly states immediate availability in PCs and the reseller channel. No unpublished boost frequency is supplied.
Cache
Cache	4 MB shared L2 cache, as Intel’s datasheet states; no L3 figure supplied.	Two 4 MB L2 caches, one per dual-core die; total 8 MB. Intel’s datasheet also lists four 32 KB L1 data caches. No L3 figure is supplied.
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics, explicitly confirmed by the exact-model CPU-Monkey specification entry. Chipset graphics are separate from the processor.	No integrated graphics, confirmed by the exact BX80562Q6600 retail listing; motherboard graphics are a separate component.
Platform
Socket
Socket	LGA775	LGA775
Base power
Base power	65 W	105 W
Unlocked
Unlocked	–	No
Cooler in the box
Cooler in the box	Yes	Yes
Memory support
Memory support	Intel’s datasheet routes memory and I/O transactions through the front-side bus and chipset; memory types and capacity depend on the motherboard.	Memory and I/O transactions pass through the front-side bus and chipset, as Intel’s datasheet states; memory types and capacity depend on the motherboard.
Process
Process	65 nm; Conroe; LGA775.	65 nm; Kentsfield; LGA775.
Cooler
Cooler	Intel’s boxed-processor specification confirms an unattached fan heatsink. Published processor TDP is 65 W.	Boxed BX80562Q6600 listing confirms heatsink and fan. Intel’s datasheet and PCN107463 distinguish original B3 105 W from later G0 95 W; the projected July 2007 conversion date is not treated as an independently verified sale day.