Intel Core 2 Duo E6600 vs Intel Core i3-13100F
Better figure, where one is clearly better
| IntelCore 2 Duo E6600 | IntelCore i3-13100F | |
|---|---|---|
| Overview | ||
| Released | July 2006 | January 2023 |
| Cores and clocks | ||
| Cores | 2 | 4 (4 performance, 0 efficiency) (better) |
| Threads | 2 | 8 (better) |
| Base clock | 2.4 GHz | 3.4 GHz |
| Boost clock | – | 4.5 GHz |
| L3 cache | – | 12 MB |
| Cores | Conroe; two cores and two threads, without Hyper-Threading. | Four P-cores and no E-cores; Hyper-Threading supported. |
| Clocks | Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel unveiled the family on 27 July 2006 and said complete Core 2 Duo desktop systems would arrive in early August. TechSpot’s 2 August review says boxed CPUs began shipping late the previous week, supporting July CPU availability without an exact sale day. No unpublished boost figure is supplied. | CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W. |
| Cache | 4 MB shared L2 cache, as Intel’s datasheet states; no L3 figure supplied. | 12 MB Intel Smart Cache (L3); 5 MB total L2. |
| Graphics and AI | ||
| Built-in graphics | No | No |
| Graphics | No integrated graphics, explicitly confirmed by the exact-model CPU-Monkey specification entry. Chipset graphics are separate from the processor. | No integrated graphics; a separate graphics card is required (Intel support). |
| AI engine | – | Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported. |
| Platform | ||
| Socket | LGA775 | LGA1700 |
| Base power | 65 W | 58 W |
| Maximum power | – | 110 W |
| Unlocked | – | No |
| Cooler in the box | Yes | Yes |
| Memory support | Intel’s datasheet routes memory and I/O transactions through the front-side bus and chipset; memory types and capacity depend on the motherboard. | Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB. |
| PCIe | – | PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8. |
| Process | 65 nm; Conroe; LGA775. | Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature. |
| Cooler | Intel’s boxed-processor specification confirms an unattached fan heatsink. Published processor TDP is 65 W. | Boxed retail processor includes Intel Laminar RM1 (Intel support). |
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