Intel Core 2 Duo E6600 vs Intel Core i3-13100F

Every spec side by side, from each maker's published figures.

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Core 2 Duo E6600 compared with Core i3-13100F
IntelCore 2 Duo E6600IntelCore i3-13100F
Overview
ReleasedJuly 2006January 2023
Cores and clocks
Cores24 (4 performance, 0 efficiency) (better)
Threads28 (better)
Base clock2.4 GHz3.4 GHz
Boost clock–4.5 GHz
L3 cache–12 MB
CoresConroe; two cores and two threads, without Hyper-Threading.Four P-cores and no E-cores; Hyper-Threading supported.
ClocksPublished operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel unveiled the family on 27 July 2006 and said complete Core 2 Duo desktop systems would arrive in early August. TechSpot’s 2 August review says boxed CPUs began shipping late the previous week, supporting July CPU availability without an exact sale day. No unpublished boost figure is supplied.CPU multiplier locked (Intel support). Current Intel specifications list 110 W maximum turbo power; the January 2023 maker launch table and Tom's Hardware list 89 W. ComputerBase also reports 110 W.
Cache4 MB shared L2 cache, as Intel’s datasheet states; no L3 figure supplied.12 MB Intel Smart Cache (L3); 5 MB total L2.
Graphics and AI
Built-in graphicsNoNo
GraphicsNo integrated graphics, explicitly confirmed by the exact-model CPU-Monkey specification entry. Chipset graphics are separate from the processor.No integrated graphics; a separate graphics card is required (Intel support).
AI engine–Intel Gaussian & Neural Accelerator 3.0; Intel Deep Learning Boost on CPU supported.
Platform
SocketLGA775LGA1700
Base power65 W58 W
Maximum power–110 W
Unlocked–No
Cooler in the boxYesYes
Memory supportIntel’s datasheet routes memory and I/O transactions through the front-side bus and chipset; memory types and capacity depend on the motherboard.Current Intel specifications support up to 192 GB; two channels; DDR5-4800 or DDR4-3200; 76.8 GB/s maximum bandwidth. The January 2023 launch table lists 128 GB.
PCIe–PCIe 5.0 and 4.0; 20 CPU lanes, configured as 1×16+4 or 2×8+4; DMI 4.0 ×8.
Process65 nm; Conroe; LGA775.Intel 7; marketed as Raptor Lake. ComputerBase identifies the H0 Alder Lake die used by the Core i3-12100F. 45 × 37.5 mm package; 100°C maximum junction temperature.
CoolerIntel’s boxed-processor specification confirms an unattached fan heatsink. Published processor TDP is 65 W.Boxed retail processor includes Intel Laminar RM1 (Intel support).

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