Intel Core 2 Duo E6600 vs Intel Core 2 Duo E8400

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Core 2 Duo E6600 compared with Core 2 Duo E8400

	IntelCore 2 Duo E6600	IntelCore 2 Duo E8400
Overview
Released
Released	July 2006	January 2008
Cores and clocks
Cores
Cores	2	2
Threads
Threads	2	2
Base clock
Base clock	2.4 GHz	3 GHz
Cores
Cores	Conroe; two cores and two threads, without Hyper-Threading.	Wolfdale; two cores and two threads, without Hyper-Threading. Intel’s archived exact E8400 specifications are attached to the maker datasheet distributed by Mouser.
Clocks
Clocks	Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel unveiled the family on 27 July 2006 and said complete Core 2 Duo desktop systems would arrive in early August. TechSpot’s 2 August review says boxed CPUs began shipping late the previous week, supporting July CPU availability without an exact sale day. No unpublished boost figure is supplied.	Published operating frequency 3.00 GHz; 1333 MHz front-side bus. Intel explicitly lists no Turbo Boost, so no boost figure is supplied. Intel’s CES fact sheet specifies January 2008 availability for this exact model; TechSpot’s 1 February review confirms retail stock, with early shortages and prices above target. An exact first-sale day remains unverified.
Cache
Cache	4 MB shared L2 cache, as Intel’s datasheet states; no L3 figure supplied.	6 MB shared L2 cache; no L3 figure supplied.
Graphics and AI
Built-in graphics
Built-in graphics	No	No
Graphics
Graphics	No integrated graphics, explicitly confirmed by the exact-model CPU-Monkey specification entry. Chipset graphics are separate from the processor.	No integrated graphics, explicitly confirmed by the exact BX80570E8400 Newegg listing; motherboard graphics are separate.
Platform
Socket
Socket	LGA775	LGA775
Base power
Base power	65 W	65 W
Cooler in the box
Cooler in the box	Yes	Yes
Memory support
Memory support	Intel’s datasheet routes memory and I/O transactions through the front-side bus and chipset; memory types and capacity depend on the motherboard.	Memory and I/O transactions pass through the front-side bus and chipset, as Intel’s datasheet states; supported memory types and capacity depend on the motherboard.
Process
Process	65 nm; Conroe; LGA775.	45 nm; Wolfdale; LGA775; SSE4.1 support.
Cooler
Cooler	Intel’s boxed-processor specification confirms an unattached fan heatsink. Published processor TDP is 65 W.	Intel’s boxed-processor specification confirms a supplied cooling solution; exact BX80570E8400 listing confirms heatsink and fan. Published processor TDP is 65 W.