Intel Core 2 Duo E6600 vs Intel Core i7-4790K

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Core 2 Duo E6600 compared with Core i7-4790K

	IntelCore 2 Duo E6600	IntelCore i7-4790K
Overview
Released
Released	July 2006	June 2014
Cores and clocks
Cores
Cores	2	4 (better)
Threads
Threads	2	8 (better)
Base clock
Base clock	2.4 GHz	4 GHz
Boost clock
Boost clock	–	4.4 GHz
L3 cache
L3 cache	–	8 MB
Cores
Cores	Conroe; two cores and two threads, without Hyper-Threading.	Four cores with Hyper-Threading; Intel Turbo Boost 2.0 supported. The current maker page lists Transactional Synchronization Extensions as unsupported, superseding early review specifications.
Clocks
Clocks	Published operating frequency 2.40 GHz; 1066 MHz front-side bus. Intel unveiled the family on 27 July 2006 and said complete Core 2 Duo desktop systems would arrive in early August. TechSpot’s 2 August review says boxed CPUs began shipping late the previous week, supporting July CPU availability without an exact sale day. No unpublished boost figure is supplied.	Maximum turbo is a single-core frequency; overclocking requires an appropriate motherboard and cooling. Intel publishes TDP without a separate maximum turbo-power figure.
Cache
Cache	4 MB shared L2 cache, as Intel’s datasheet states; no L3 figure supplied.	–
Graphics and AI
Built-in graphics
Built-in graphics	No	Yes
Graphics
Graphics	No integrated graphics, explicitly confirmed by the exact-model CPU-Monkey specification entry. Chipset graphics are separate from the processor.	Intel HD Graphics 4600; 20 execution units; 350 MHz base, up to 1.25 GHz; three displays; Quick Sync Video. HDMI up to 3840×2160 at 24 Hz; DisplayPort and eDP up to 3840×2160 at 60 Hz; VGA up to 1920×1200 at 60 Hz.
Platform
Socket
Socket	LGA775	LGA1150
Base power
Base power	65 W	88 W
Unlocked
Unlocked	–	Yes
Cooler in the box
Cooler in the box	Yes	–
Memory support
Memory support	Intel’s datasheet routes memory and I/O transactions through the front-side bus and chipset; memory types and capacity depend on the motherboard.	Up to 32 GB; two channels; DDR3-1333/1600 or DDR3L-1333/1600 at 1.5 V, as listed by Intel; 25.6 GB/s maximum bandwidth; ECC not supported.
PCIe
PCIe	–	PCIe 3.0; 16 CPU lanes, configured as 1×16, 2×8 or 1×8+2×4.
Process
Process	65 nm; Conroe; LGA775.	22 nm; Devil's Canyon, a Haswell refresh; 37.5 × 37.5 mm package; 74.04°C Tcase limit, not a junction-temperature limit. New polymer thermal interface and additional capacitors, described in Intel's Computex launch coverage and the exact-model reviews.
Cooler
Cooler	Intel’s boxed-processor specification confirms an unattached fan heatsink. Published processor TDP is 65 W.	Intel lists both ordinary boxed and explicitly fanless boxed SKUs; cooler contents should be checked for the particular package. Compatible Intel 8- and 9-series chipsets require the appropriate motherboard BIOS. Intel's June 2014 fact sheet confirms volume availability that month; the announcement itself is not used as the on-sale day.